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DAC8830IBDTG4

Texas Instruments

DAC8830IBDTG4 by Texas Instruments

DAC8830IBDTG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.5V and linearity error of 0.0031%. Ideal for industrial applications, it operates b/w -40 to 85°C, settling in just 1us. With low supply current of 0.02mA, this surface-mount device offers precise digital-to-analog conversion.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,470 parts In-Stock

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Digiode

USA . 634 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 414 parts In-Stock

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$1.000

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Ampacity Inc.

Singapore . 1,614 parts In-Stock

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$7.000

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Parana Technologies

USA . 2,302 parts In-Stock

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$8.556

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$9.215

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AZTECH Wire

Italy . 307 parts In-Stock

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$9.321

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IDEA Electronic Components Group

UK . 877 parts In-Stock

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$9.614

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$9.133

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$8.653

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ChromeModa Solutions

Germany . 263 parts In-Stock

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$9.614

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$7.883

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Corohmni

South Africa . 364 parts In-Stock

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Modulus Dynamics

Lithuania . 60 parts In-Stock

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Semicontronic

India . 492 parts In-Stock

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Continental Prestige Electronics

USA . 6,001 parts In-Stock

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Corphita

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Argo Parts USA

USA . 3,633 parts In-Stock

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DigiPath Technology Company

USA . 759 parts In-Stock

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Microchip USA

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Advanced Electronics

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Bastille Electronics

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Overview

Unlock the power of precision with the Texas Instruments DAC8830IBDTG4 Digital-to-Analog Converter. Crafted by a trusted industry leader, this cutting-edge device delivers unparalleled accuracy and reliability for a wide range of applications. From industrial automation to audio equipment, this versatile converter offers seamless integration, exceptional performance, and unmatched value. Elevate your projects with the DAC8830IBDTG4 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Allows for a wide range of analog output signals, suitable for a variety of applications.

No. of Bits: 16

Higher number of bits results in better resolution and accuracy of the analog output signal.

Maximum Linearity Error (EL): 0.0031 %

Low linearity error ensures accurate conversion from digital signals to analog output.

Power Supplies (V): 3/5

Supports multiple power supply options, increasing flexibility in system design.

Nominal Settling Time (tstl): 1 us

Fast settling time ensures quick response to input changes, ideal for real-time applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, ensuring stable performance.

Technical Specifications

Digital-to-Analog Converters DAC8830IBDTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0031 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

20 μA

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

Trade Compliance

DAC8830IBDTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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