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DAC87H-CBI-V

Texas Instruments

DAC87H-CBI-V by Texas Instruments

DAC87H-CBI-V by Texas Instruments is a 12-bit D/A converter with 0.012% EL, 4us settling time, and +-12/+-15V power supplies. Ideal for military applications, it operates b/w -55 to 125 °C with ceramic package and through-hole terminals.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 2,925 parts In-Stock

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Vyrian

USA . 2,746 parts In-Stock

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ECAB

Sweden . 2 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Northwest PG Solutions

USA . 736 parts In-Stock

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$2.728

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AZTECH Wire

Italy . 557 parts In-Stock

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$11.875

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Parana Technologies

USA . 1,757 parts In-Stock

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$22.039

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$22.598

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ChromeModa Solutions

Germany . 6,179 parts In-Stock

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IDEA Electronic Components Group

UK . 809 parts In-Stock

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$23.525

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$22.287

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One Stop Electronics

USA . 1,568 parts In-Stock

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$37.000

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Corphita

USA . 5,230 parts In-Stock

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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Native Components

USA . 386 parts In-Stock

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Kepictronics

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Overview

Discover the superior quality and precision of the Texas Instruments DAC87H-CBI-V, a top-tier D/A converter designed for military-grade applications. With its ceramic package body material and exceptional linearity error of just 0.012%, this converter offers unparalleled performance and reliability. Whether you're in aerospace, defense, or industrial automation, this product delivers fast settling time, wide temperature range, and dual-terminal position for seamless integration. Elevate your projects with the unmatched value and benefits of the DAC87H-CBI-V by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal performance and high reliability, making this converter suitable for rugged environments and extended temperature ranges.

No. of Bits: 12

With 12 bits of resolution, this converter can provide precise and accurate analog outputs for various applications requiring high resolution conversion.

Maximum Settling Time: 4 us

The fast settling time of 4 microseconds ensures that the converter can quickly stabilize and provide accurate output signals, making it ideal for real-time applications.

Power Supplies (V): +-12/+-15

The dual power supply options of +-12V and +-15V provide flexibility in interfacing with different systems and voltage levels, enhancing the converter's compatibility.

Temperature Grade: MILITARY

Designed to meet stringent military standards, this converter is reliable and durable in harsh environments, making it a suitable choice for defense and aerospace applications.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product can convert digital signals into precise analog outputs, enabling seamless integration with analog systems and devices.

Technical Specifications

Other Function Converters DAC87H-CBI-V attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

Bipolar

No. of Bits:

12

No. of Functions:

1

Input Bit Code:

Complementary Binary, Complementary Offset Binary

Maximum Linearity Error (EL):

0.012 %

Maximum Settling Time:

4 µs

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Shape:

Package Body Material:

Ceramic

Package Code:

DIP

Package Style:

In-Line

Package Equivalence Code:

DIP24,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-XDIP-T24

Trade Compliance

DAC87H-CBI-V Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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