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DAC85H-CBI-I

Texas Instruments

DAC85H-CBI-I by Texas Instruments

DAC85H-CBI-I by Texas Instruments is a 12-bit D/A converter with 4us settling time, 0.012% linearity error, and +-12/+-15V power supplies. It is used in applications requiring precise analog signal generation within -25 to 85 °C temperature range.

Median Price

$85.326

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 3 parts In-Stock

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$85.326

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$85.326

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Vyrian

USA . 3,512 parts In-Stock

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Digiode

USA . 3,439 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 4 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,927 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 296 parts In-Stock

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$10.926

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Parana Technologies

USA . 1,552 parts In-Stock

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$12.375

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$12.812

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$12.375

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DigiPath Technology Company

USA . 274 parts In-Stock

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$13.626

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

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$13.904

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$13.209

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$12.514

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1,884

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ChromeModa Solutions

Germany . 1,059 parts In-Stock

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$13.904

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$11.401

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Corphita

USA . 1,727 parts In-Stock

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Northwest PG Solutions

USA . 1,551 parts In-Stock

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Native Components

USA . 568 parts In-Stock

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Overview

Enhance your electronic designs with the Texas Instruments DAC85H-CBI-I, a premium quality D/A converter that delivers unparalleled performance and precision. Manufactured by industry leader Texas Instruments, this converter is ideal for a wide range of applications in various industries. With its fast settling time, high linearity accuracy, and versatile power supplies, the DAC85H-CBI-I offers exceptional value and reliability to customers seeking top-notch functionality in their projects. Upgrade your designs today with the superior quality of Texas Instruments DAC85H-CBI-I.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal stability and reliability, making it suitable for a wide range of operating temperatures.

No. of Bits: 12

With 12 bits, this converter offers high resolution and accuracy in converting analog signals to digital, suitable for various applications requiring precise measurements.

Maximum Settling Time: 4 us

Fast settling time ensures quick and accurate conversion of input signals, making this converter ideal for applications that require rapid response times.

Maximum Linearity Error (EL): 0.012 %

Low linearity error ensures accuracy in converting analog signals to digital with minimal distortion, making this converter reliable for precision applications.

Power Supplies (V): +-12/+-15

Wide range of power supplies allows for flexibility in system integration and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in various environmental conditions, ensuring durability and stability over time.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and easy soldering during assembly, ensuring robust connections for long-term reliability.

Converter Type: D/A CONVERTER

Digital-to-analog converter type enables precise conversion of digital signals to analog, making this product suitable for applications requiring accurate signal processing.

Technical Specifications

Other Function Converters DAC85H-CBI-I attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

Bipolar

No. of Bits:

12

No. of Functions:

1

Input Bit Code:

Complementary Binary, Complementary Offset Binary

Maximum Linearity Error (EL):

0.012 %

Maximum Settling Time:

4 µs

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Shape:

Package Body Material:

Ceramic

Package Code:

DIP

Package Style:

In-Line

Package Equivalence Code:

DIP24,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-XDIP-T24

Trade Compliance

DAC85H-CBI-I Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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