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DAC8560ICDGKTG4

Texas Instruments

DAC8560ICDGKTG4 by Texas Instruments

DAC8560ICDGKTG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 2.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, with input format as serial and supply voltage at 3V.

Median Price

$7.923

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,524 parts In-Stock

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$7.923

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Chip Stock

USA . 24,920 parts In-Stock

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Vyrian

USA . 4,641 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 217 parts In-Stock

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$6.282

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217

$6.282

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Semicontronic

India . 249 parts In-Stock

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$7.090

100+ parts

$6.913

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$6.877

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249

$7.090

$6.913

$6.877

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Ampacity Inc.

Singapore . 136 parts In-Stock

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$7.090

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136

$7.090

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Corphita

USA . 3,038 parts In-Stock

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$7.506

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Parana Technologies

USA . 1,256 parts In-Stock

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$11.136

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$11.588

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$11.588

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DigiPath Technology Company

USA . 1,294 parts In-Stock

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$12.262

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$11.281

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$12.262

$11.281

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ChromeModa Solutions

Germany . 1,279 parts In-Stock

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$12.512

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$10.260

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IDEA Electronic Components Group

UK . 75 parts In-Stock

1+ parts

$12.512

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$11.886

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$11.261

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75

$12.512

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$11.261

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Corohmni

South Africa . 52 parts In-Stock

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$14.422

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52

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Continental Prestige Electronics

USA . 5,521 parts In-Stock

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Argo Parts USA

USA . 3,363 parts In-Stock

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Microchip USA

USA . 1,025 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC8560ICDGKTG4 Digital-to-Analog Converter. Crafted by industry leader Texas Instruments, this cutting-edge device offers unparalleled quality and reliability. Ideal for a wide range of applications, this converter provides a seamless transition from digital to analog signals with lightning-fast settling times and unbeatable linearity. With its compact design and low power consumption, the DAC8560ICDGKTG4 is the perfect solution for your analog output needs. Upgrade your system today and experience the difference for yourself.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5005 V

Provides a high maximum output voltage, allowing for a wide range of analog signal output possibilities.

No. of Bits: 16

Higher number of bits allows for greater resolution and accuracy in converting digital signals to analog.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes this product suitable for use in various environments and conditions.

Sample Rate: 0.2 MHz

High sample rate ensures fast and accurate conversion of digital signals to analog, suitable for demanding applications.

Technical Specifications

Digital-to-Analog Converters DAC8560ICDGKTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0183 %

Nominal Settling Time (tstl):

8 µs

Maximum Supply Current:

850 μA

Maximum Settling Time:

10 µs

Sample Rate:

200 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.5005 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8560ICDGKTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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