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DAC8550IBDGKRG4

Texas Instruments

DAC8550IBDGKRG4 by Texas Instruments

DAC8550IBDGKRG4 by Texas Instruments is a 16-bit D/A converter with 5.5V max analog output voltage, 0.0122% linearity error, and 10us settling time. Ideal for industrial applications requiring precise analog signal generation in a compact form factor with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,050 parts In-Stock

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8,050

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Chip Stock

USA . 7,220 parts In-Stock

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7,220

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Digiode

USA . 2,518 parts In-Stock

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2,518

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Parana Technologies

USA . 596 parts In-Stock

1+ parts

$6.903

100+ parts

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$7.509

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596

$6.903

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$7.509

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DigiPath Technology Company

USA . 399 parts In-Stock

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$7.601

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$7.601

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

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$7.756

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$6.980

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$7.756

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$6.980

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ChromeModa Solutions

Germany . 1,876 parts In-Stock

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$7.756

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$6.360

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$7.756

$6.360

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AZTECH Wire

Italy . 851 parts In-Stock

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$12.048

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851

$12.048

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Corohmni

South Africa . 192 parts In-Stock

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$23.934

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One Stop Electronics

USA . 579 parts In-Stock

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$29.000

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Semicontronic

India . 1,185 parts In-Stock

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$36.000

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$35.100

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$34.920

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$36.000

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Ampacity Inc.

Singapore . 1,077 parts In-Stock

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$36.000

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Continental Prestige Electronics

USA . 6,925 parts In-Stock

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Argo Parts USA

USA . 3,075 parts In-Stock

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Corphita

USA . 1,728 parts In-Stock

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Microchip USA

USA . 1,235 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 58 parts In-Stock

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Overview

Experience the unparalleled precision and reliability of Texas Instruments with the DAC8550IBDGKRG4 Digital-to-Analog Converter. This top-of-the-line device offers seamless integration, superior performance, and exceptional value for a wide range of applications. Whether you're in need of high-quality audio output, precise sensor control, or efficient signal processing, this product delivers unmatched accuracy and efficiency. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

High maximum output voltage allows for versatile use in a wide range of applications.

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and longevity.

Surface Mount: YES

Easy installation with surface mount design for efficient PCB assembly.

Package Shape: SQUARE

Square package shape provides space-saving and compact design.

No. of Bits: 16

16-bit resolution ensures high accuracy and precision in analog to digital conversion.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate output response.

Maximum Linearity Error (EL): 0.0122%

Low linearity error ensures accurate conversion of digital signals to analog output.

Power Supplies (V): 3/5

Compatible with a wide range of power supplies for flexibility in use.

No. of Terminals: 8

Compact design with 8 terminals for easy connectivity and integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile for space-saving installation.

Nominal Settling Time (tstl): 8 us

Fast nominal settling time ensures quick and precise analog output.

Maximum Operating Temperature: 105 °C

Wide operating temperature range for versatility in different environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without performance degradation.

Terminal Finish: NICKΕL PALLADIUM GOLD SILVER

High-quality terminal finish for reliable and stable connections.

Terminal Position: DUAL

Dual terminal position for flexibility in wiring and installation.

Maximum Seated Height: 1.1 mm

Low seated height for compact PCB design and space efficiency.

Width: 3 mm

Slim width for compact and space-saving installation.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for easy and efficient reflow soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperatures for reliable soldering.

Minimum Analog Output Voltage: 0 V

Low minimum output voltage allows for precision in analog signal conversion.

Length: 3 mm

Compact length for space-saving installation.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications requiring robust performance in various temperature conditions.

Sample Rate: 0.2 MHz

High sample rate ensures accurate conversion of digital signals to analog output.

Terminal Form: GULL WING

Gull wing terminal form for easy mounting and soldering on PCBs.

Maximum Supply Current: 0.25 mA

Low supply current for energy-efficient operation.

Input Format: SERIAL

Serial input format for easy integration with digital systems.

Converter Type: D/A CONVERTER

Digital-to-analog converter type for converting digital signals to analog output.

Nominal Supply Voltage: 3 V

Nominal supply voltage for stable and reliable performance.

Terminal Pitch: 0.65 mm

Small terminal pitch for compact PCB layout and space efficiency.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating for safe storage and handling in humid environments.

Input Bit Code: 2'S COMPLEMENT BINARY

2's complement binary input bit code for accurate signal processing.

Technical Specifications

Digital-to-Analog Converters DAC8550IBDGKRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

8 µs

Maximum Supply Current:

250 μA

Maximum Settling Time:

10 µs

Sample Rate:

200 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8550IBDGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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