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DAC8541Y/2K

Texas Instruments

DAC8541Y/2K by Texas Instruments

D/A CONVERTER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TFQFP; Package Shape: SQUARE;

Median Price

$5.396

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,889 parts In-Stock

1+ parts

$5.343

100+ parts

$4.356

1k+ parts

$2.904

10k+ parts

-

14,889

$5.343

$4.356

$2.904

-

Rochester

USA . 16,523 parts In-Stock

1+ parts

-

100+ parts

$4.360

1k+ parts

$3.900

10k+ parts

$3.670

16,523

-

$4.360

$3.900

$3.670

DigiKey

USA . 16,523 parts In-Stock

1+ parts

-

100+ parts

$5.740

1k+ parts

-

10k+ parts

-

16,523

-

$5.740

-

-

Verical

USA . 16,523 parts In-Stock

1+ parts

-

100+ parts

$5.450

1k+ parts

$4.875

10k+ parts

$4.588

16,523

-

$5.450

$4.875

$4.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 489 parts In-Stock

1+ parts

$3.828

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$3.828

-

-

-

Vyrian

USA . 3,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,636

-

-

-

-

Zilex Electronics Inc.

Canada . 250 parts In-Stock

1+ parts

-

100+ parts

-

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250

-

-

-

-

Bristol Electronics

USA . 68 parts In-Stock

1+ parts

-

100+ parts

-

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68

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,025 parts In-Stock

1+ parts

$3.627

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$3.627

-

-

-

Parana Technologies

USA . 271 parts In-Stock

1+ parts

$14.838

100+ parts

-

1k+ parts

$15.269

10k+ parts

-

271

$14.838

-

$15.269

-

ChromeModa Solutions

Germany . 4,642 parts In-Stock

1+ parts

$16.672

100+ parts

$13.671

1k+ parts

-

10k+ parts

-

4,642

$16.672

$13.671

-

-

IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$16.672

100+ parts

$15.838

1k+ parts

$15.005

10k+ parts

-

1,883

$16.672

$15.838

$15.005

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

-

DigiPath Technology Company

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

$15.031

1k+ parts

-

10k+ parts

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1,262

-

$15.031

-

-

Native Components

USA . 881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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881

-

-

-

-

Northwest PG Solutions

USA . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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664

-

-

-

-

Technical Specifications

Digital-to-Analog Converters DAC8541Y/2K attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.098 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

400 μA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

2/5,3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

32

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Trade Compliance

DAC8541Y/2K Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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