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DAC8532IDGKRG4

Texas Instruments

DAC8532IDGKRG4 by Texas Instruments

DAC8532IDGKRG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105 °C with low power consumption at 0.8mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,375 parts In-Stock

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Vyrian

USA . 2,030 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 243 parts In-Stock

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$6.397

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243

$6.397

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Parana Technologies

USA . 257 parts In-Stock

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$21.291

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$21.609

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257

$21.291

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DigiPath Technology Company

USA . 875 parts In-Stock

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$23.445

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$21.569

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875

$23.445

$21.569

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ChromeModa Solutions

Germany . 2,715 parts In-Stock

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$23.923

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$19.617

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$23.923

$19.617

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IDEA Electronic Components Group

UK . 221 parts In-Stock

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$23.923

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$22.727

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$21.531

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221

$23.923

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$21.531

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One Stop Electronics

USA . 994 parts In-Stock

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$34.000

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994

$34.000

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Ampacity Inc.

Singapore . 797 parts In-Stock

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$38.000

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$38.000

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Continental Prestige Electronics

USA . 5,765 parts In-Stock

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Corphita

USA . 2,452 parts In-Stock

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Microchip USA

USA . 1,915 parts In-Stock

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Argo Parts USA

USA . 1,831 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your electronic designs with the DAC8532IDGKRG4 from Texas Instruments, a leading manufacturer known for high-quality components. As part of the Digital-to-Analog Converters category, this product offers precise analog output voltage up to 5.5V with fast settling time and minimal linearity error. Perfect for industrial applications, this D/A converter provides exceptional value and performance, ensuring your projects operate smoothly and efficiently. Trust in Texas Instruments for cutting-edge technology that delivers superior results.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Higher output voltage allows for greater flexibility and compatibility with various systems.

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures reliability and ease of handling.

No. of Bits: 16

Higher number of bits allows for more precise and accurate digital-to-analog conversion.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and accuracy in the conversion process.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies makes this converter versatile for different applications.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures performance even in extreme conditions.

Technical Specifications

Digital-to-Analog Converters DAC8532IDGKRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0987 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

800 μA

Maximum Settling Time:

10 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8532IDGKRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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