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DAC8164IBPWR

Texas Instruments

DAC8164IBPWR by Texas Instruments

DAC8164IBPWR by Texas Instruments is a 14-bit D/A converter with max analog output voltage of 2.5005V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105 °C with low power consumption at 1.6mA, featuring a small outline package style for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,788 parts In-Stock

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Digiode

USA . 221 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 51 parts In-Stock

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$1.506

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51

$1.506

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Northwest PG Solutions

USA . 209 parts In-Stock

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$1.657

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Parana Technologies

USA . 527 parts In-Stock

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$7.839

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$8.392

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$7.839

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$8.632

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$7.941

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$8.632

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ChromeModa Solutions

Germany . 2,346 parts In-Stock

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$8.808

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$7.223

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$8.808

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

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$8.808

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$8.368

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$7.927

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One Stop Electronics

USA . 1,538 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 848 parts In-Stock

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$12.346

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Corphita

USA . 4,032 parts In-Stock

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Microchip USA

USA . 207 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the Texas Instruments DAC8164IBPWR Digital-to-Analog Converter. Crafted with industry-leading expertise, this cutting-edge device boasts unmatched quality and reliability. Ideal for a wide range of applications, this converter offers seamless integration, exceptional accuracy, and rapid settling times. Experience the value of superior engineering and elevate your projects to new heights with the DAC8164IBPWR by Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5005 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals to be accurately converted from digital to analog.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and longevity of the product, making it reliable for long-term use.

No. of Bits: 14

With 14 bits, this converter offers a high resolution and accuracy in converting digital signals to analog, resulting in precise output.

Maximum Settling Time: 10 us

Fast settling time of 10 us ensures that the converter quickly stabilizes to the desired output voltage, improving efficiency and responsiveness.

Power Supplies (V): 3/5

Supports multiple power supplies of 3V and 5V, offering flexibility in different system configurations and power requirements.

Maximum Operating Temperature: 105 °C

Can operate at high temperatures up to 105°C, making it suitable for industrial-grade applications where temperatures may vary.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures down to -40°C, ensuring reliability in various environmental conditions.

Input Format: SERIAL

Supports serial input format, making it compatible with a wide range of digital devices and systems for easy integration.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter, this product is essential for converting digital signals to analog signals, enabling communication between digital and analog systems.

Technical Specifications

Digital-to-Analog Converters DAC8164IBPWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

1.6 mA

Maximum Settling Time:

10 µs

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.5005 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

DAC8164IBPWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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