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DAC8043UCG4

Texas Instruments

DAC8043UCG4 by Texas Instruments

DAC8043UCG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 2.5V and settling time of 1us. Ideal for industrial applications, it operates at -40 to 85°C, features CMOS technology, and consumes only 0.5mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,607 parts In-Stock

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Digiode

USA . 2,773 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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15

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AZTECH Wire

Italy . 670 parts In-Stock

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$5.177

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670

$5.177

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Semicontronic

India . 1,575 parts In-Stock

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$7.000

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$6.825

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$6.790

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$7.000

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$6.790

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Corohmni

South Africa . 323 parts In-Stock

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$14.804

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Parana Technologies

USA . 948 parts In-Stock

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$20.648

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$20.757

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948

$20.648

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$20.757

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DigiPath Technology Company

USA . 1,707 parts In-Stock

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$22.736

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$20.917

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$22.736

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ChromeModa Solutions

Germany . 2,628 parts In-Stock

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$23.200

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$19.024

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$23.200

$19.024

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IDEA Electronic Components Group

UK . 832 parts In-Stock

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$23.200

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$22.040

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$20.880

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832

$23.200

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$20.880

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Ampacity Inc.

Singapore . 866 parts In-Stock

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$24.000

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One Stop Electronics

USA . 1,427 parts In-Stock

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$37.000

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Microchip USA

USA . 5,769 parts In-Stock

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Corphita

USA . 3,747 parts In-Stock

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Continental Prestige Electronics

USA . 3,507 parts In-Stock

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Argo Parts USA

USA . 2,762 parts In-Stock

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC8043UCG4 Digital-to-Analog Converter. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and reliability in this product. Ideal for a wide range of applications, this converter provides a maximum analog output voltage of 2.5V, with quick settling time and minimal linearity error. With its compact package and low power consumption, the DAC8043UCG4 offers unmatched value and performance to customers looking for high-quality analog signal conversion. Elevate your design with Texas Instruments today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

Higher maximum analog output voltage allows for a wider range of signal output, providing greater flexibility and accuracy in analog applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and versatility while also keeping the overall product lightweight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

No. of Bits: 12

Higher number of bits translates to higher resolution and accuracy in analog-to-digital conversion, making this product suitable for precision applications.

Maximum Settling Time: 1 us

Fast settling time ensures quick and accurate output response, crucial for time-sensitive applications.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes it compatible with most electronic systems and easy to integrate into existing setups.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environments, including industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Digital-to-Analog Converters DAC8043UCG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

250 ns

Maximum Supply Current:

500 μA

Maximum Settling Time:

1 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8043UCG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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