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DAC5681ZIRGCR

Texas Instruments

DAC5681ZIRGCR by Texas Instruments

DAC5681ZIRGCR by Texas Instruments is a 16-bit D/A converter with 4.1V max analog output voltage and 1000MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C, features CMOS technology, and supports parallel input format.

Median Price

$48.131

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,303 parts In-Stock

1+ parts

$48.131

100+ parts

$42.783

1k+ parts

$31.458

10k+ parts

-

6,303

$48.131

$42.783

$31.458

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,826 parts In-Stock

1+ parts

$45.724

100+ parts

-

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-

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4,826

$45.724

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Vyrian

USA . 8,886 parts In-Stock

1+ parts

-

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-

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8,886

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,574 parts In-Stock

1+ parts

$11.562

100+ parts

-

1k+ parts

$11.971

10k+ parts

-

1,574

$11.562

-

$11.971

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DigiPath Technology Company

USA . 852 parts In-Stock

1+ parts

$12.731

100+ parts

$11.713

1k+ parts

-

10k+ parts

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852

$12.731

$11.713

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-

ChromeModa Solutions

Germany . 3,978 parts In-Stock

1+ parts

$12.991

100+ parts

$10.653

1k+ parts

-

10k+ parts

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3,978

$12.991

$10.653

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$12.991

100+ parts

$12.341

1k+ parts

$11.692

10k+ parts

-

1,675

$12.991

$12.341

$11.692

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$21.700

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-

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344

$21.700

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Corphita

USA . 1,070 parts In-Stock

1+ parts

$43.318

100+ parts

-

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1,070

$43.318

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Northwest PG Solutions

USA . 1,218 parts In-Stock

1+ parts

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1,218

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Native Components

USA . 116 parts In-Stock

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116

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Overview

Unlock the power of precision with the DAC5681ZIRGCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Digital-to-Analog Converters. Perfect for industrial applications, this 16-bit converter offers a maximum analog output voltage of 4.1V and a fast nominal settling time of 0.0104us. With a compact square package style and advanced CMOS technology, this chip carrier is a game-changer in the world of electronics. Experience unmatched performance and value with the DAC5681ZIRGCR from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

Higher maximum analog output voltage allows for greater precision and accuracy in converting digital signals to analog signals.

No. of Bits: 16

Having 16 bits allows for a higher resolution in the conversion process, resulting in more accurate and detailed analog output.

Sample Rate: 1000 MHz

A high sample rate of 1000 MHz enables fast and efficient conversion of digital signals to analog signals, making this product suitable for demanding applications that require real-time processing.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it reliable and energy-efficient for various applications.

Input Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple input bit codes gives flexibility in interfacing with different digital systems, making it versatile for various integration scenarios.

Technical Specifications

Digital-to-Analog Converters DAC5681ZIRGCR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10.4 ns

Sample Rate:

1000 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Power Supplies:

1.8,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC5681ZIRGCR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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