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DAC5670IGDJ

Texas Instruments

DAC5670IGDJ by Texas Instruments

DAC5670IGDJ by Texas Instruments is a 14-bit D/A converter with max analog output voltage of 4.1V and linearity error of 0.0458%. Ideal for industrial applications, it operates b/w -40 to 85°C, has a settling time of 0.0035us, and requires a supply current of 650mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,075 parts In-Stock

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6,075

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Digiode

USA . 4,472 parts In-Stock

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4,472

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Distributors (Availability)

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Parana Technologies

USA . 1,698 parts In-Stock

1+ parts

$8.007

100+ parts

-

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$8.585

10k+ parts

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1,698

$8.007

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$8.585

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DigiPath Technology Company

USA . 2,315 parts In-Stock

1+ parts

$8.817

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2,315

$8.817

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ChromeModa Solutions

Germany . 6,940 parts In-Stock

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$8.997

100+ parts

$7.378

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$8.997

$7.378

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IDEA Electronic Components Group

UK . 1,452 parts In-Stock

1+ parts

$8.997

100+ parts

$8.547

1k+ parts

$8.097

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1,452

$8.997

$8.547

$8.097

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AZTECH Wire

Italy . 529 parts In-Stock

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$12.591

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529

$12.591

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One Stop Electronics

USA . 729 parts In-Stock

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$29.000

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729

$29.000

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Native Components

USA . 904 parts In-Stock

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$33.486

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$32.147

904

$33.486

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$32.147

Northwest PG Solutions

USA . 1,260 parts In-Stock

1+ parts

$36.835

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1,260

$36.835

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Corphita

USA . 4,264 parts In-Stock

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4,264

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Perfect Parts

USA . 599 parts In-Stock

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599

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Microchip USA

USA . 411 parts In-Stock

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411

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Formix International (Excess)

India . 1 parts In-Stock

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Overview

Unlock the power of precision and reliability with the DAC5670IGDJ from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Digital-to-Analog Converters that offer unparalleled quality and performance. Ideal for a wide range of applications, this converter provides a maximum analog output voltage of 4.1 V and a nominal settling time of just 0.0035 us. With a temperature grade of industrial and a moisture sensitivity level of 4, this product ensures consistent and accurate results in any environment. Experience the value and benefits of Texas Instruments technology with the DAC5670IGDJ.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

Higher maximum analog output voltage allows for greater flexibility in signal processing and output range.

No. of Bits: 14

With 14 bits, this digital-to-analog converter provides higher resolution and accuracy in converting digital signals to analog.

Maximum Linearity Error (EL): 0.0458 %

Low linearity error ensures accurate representation of the input signal, leading to high fidelity analog output.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V makes it compatible with many systems and easy to integrate.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C ensures reliable performance in various environments.

Technical Specifications

Digital-to-Analog Converters DAC5670IGDJ attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Complementary Binary

Maximum Linearity Error (EL):

0.0458 %

Nominal Settling Time (tstl):

3.5 ns

Maximum Supply Current:

650 mA

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

4

Form Factor

No. of Terminals:

252

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.039 in (1 mm)

Terminal Finish:

Tin Lead

Surface Mount:

Yes

Width:

0.669 in (17 mm)

Length:

0.669 in (17 mm)

Maximum Seated Height:

0.08 in (2.02 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Equivalence Code:

BGA252,16X16,40

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PBGA-B252

JESD-609 Code:

e0

Trade Compliance

DAC5670IGDJ Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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