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DAC4813JP

Texas Instruments

DAC4813JP by Texas Instruments

DAC4813JP by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±10 V. It has 4 functions, settling time of 6 us, and operates at temperatures from 0 to 70°C. Ideal for applications requiring precise analog signal generation in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,639 parts In-Stock

1+ parts

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7,639

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Digiode

USA . 2,952 parts In-Stock

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2,952

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Distributors (Availability)

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Native Components

USA . 80 parts In-Stock

1+ parts

$0.670

100+ parts

-

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80

$0.670

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Northwest PG Solutions

USA . 452 parts In-Stock

1+ parts

$0.737

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-

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452

$0.737

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AZTECH Wire

Italy . 690 parts In-Stock

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$17.072

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690

$17.072

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Parana Technologies

USA . 1,535 parts In-Stock

1+ parts

$24.781

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$25.455

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1,535

$24.781

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$25.455

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DigiPath Technology Company

USA . 2,026 parts In-Stock

1+ parts

$27.287

100+ parts

$25.104

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2,026

$27.287

$25.104

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ChromeModa Solutions

Germany . 6,252 parts In-Stock

1+ parts

$27.844

100+ parts

$22.832

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6,252

$27.844

$22.832

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IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$27.844

100+ parts

$26.452

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$25.060

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728

$27.844

$26.452

$25.060

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One Stop Electronics

USA . 1,840 parts In-Stock

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$32.000

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1,840

$32.000

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Corphita

USA . 4,093 parts In-Stock

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4,093

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Overview

Upgrade your digital-to-analog conversion experience with the Texas Instruments DAC4813JP. With a reputation for excellence in manufacturing, this high-quality device offers unparalleled performance and reliability. Perfect for a wide range of applications, this converter provides a maximum analog output voltage of 10V and features 12 bits for precise conversions. Trust Texas Instruments to deliver innovation and value in every product - see the difference for yourself with the DAC4813JP.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

This high maximum analog output voltage allows for a wide range of output signals, making this product versatile for different applications.

No. of Functions: 4

Having multiple functions in one device can save space and complexity in a system, making it more efficient.

No. of Bits: 12

A higher number of bits allows for a finer resolution and accuracy in the analog output signal.

Maximum Settling Time: 6 us

The fast settling time ensures quick and accurate output response, making this product suitable for real-time applications.

Power Supplies (V): +-12/+-15

The dual power supply options provide flexibility in powering the device, accommodating different system requirements.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability.

Package Style (Meter): IN-LINE

The in-line packaging style helps in easy integration and space-saving in a system layout.

Technical Specifications

Digital-to-Analog Converters DAC4813JP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

4.5 µs

Maximum Supply Current:

60 mA

Maximum Settling Time:

6 µs

No. of Bits:

12

No. of Functions:

4

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

Trade Compliance

DAC4813JP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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