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DAC4815BP

Texas Instruments

DAC4815BP by Texas Instruments

DAC4815BP by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±13.6 V and settling time of 10 us. Widely used in industrial applications, it features a package style of IN-LINE, operates b/w -40 to 85 °C, and has a terminal pitch of 2.54 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,608 parts In-Stock

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Digiode

USA . 1,821 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 14 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Northwest PG Solutions

USA . 2,156 parts In-Stock

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$3.238

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One Stop Electronics

USA . 2,169 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 756 parts In-Stock

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$18.333

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Parana Technologies

USA . 1,370 parts In-Stock

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$24.608

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$25.270

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DigiPath Technology Company

USA . 965 parts In-Stock

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$27.096

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$24.928

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IDEA Electronic Components Group

UK . 1,570 parts In-Stock

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$27.649

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$26.267

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$24.884

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ChromeModa Solutions

Germany . 741 parts In-Stock

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$27.649

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$22.672

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Native Components

USA . 893 parts In-Stock

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Corphita

USA . 779 parts In-Stock

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Assy Fe

Spain . 400 parts In-Stock

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Perfect Parts

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Overview

Experience precision and reliability with the Texas Instruments DAC4815BP digital-to-analog converter. Crafted by a trusted manufacturer, this product offers unparalleled performance in a variety of applications. With its high-quality components and advanced technology, you can trust that your projects will be executed flawlessly. Whether you're working on industrial automation or audio equipment, the DAC4815BP provides exceptional value and benefits to meet your needs. Upgrade to Texas Instruments for superior results every time.

Feature Benefit Bullets

Maximum Analog Output Voltage: 13.6 V

Provides high output voltage for a wide range of applications.

No. of Functions: 4

Offers multiple functions in a single device, increasing efficiency and reducing the need for multiple components.

No. of Bits: 12

Provides high resolution and accuracy for analog-to-digital conversion.

Maximum Settling Time: 10 us

Ensures quick and accurate settling time for rapid data conversion.

Power Supplies (V): 5,+-12/+-15

Compatible with a variety of power supply voltages, offering flexibility in design.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high operating temperatures.

Technical Specifications

Digital-to-Analog Converters DAC4815BP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

BIMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

4

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-13.6 V

Maximum Analog Output Voltage:

13.6 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

Trade Compliance

DAC4815BP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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