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DAC38RF90IAAV

Texas Instruments

DAC38RF90IAAV by Texas Instruments

D/A CONVERTER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$135.887

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,538 parts In-Stock

1+ parts

$135.887

100+ parts

$123.001

1k+ parts

$117.144

10k+ parts

-

4,538

$135.887

$123.001

$117.144

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,408 parts In-Stock

1+ parts

$129.093

100+ parts

-

1k+ parts

-

10k+ parts

-

2,408

$129.093

-

-

-

Vyrian

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

-

-

-

-

Chip Stock

USA . 285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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285

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 262 parts In-Stock

1+ parts

$0.719

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$0.719

-

-

-

Northwest PG Solutions

USA . 1,556 parts In-Stock

1+ parts

$0.791

100+ parts

-

1k+ parts

-

10k+ parts

-

1,556

$0.791

-

-

-

AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$11.590

100+ parts

-

1k+ parts

-

10k+ parts

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311

$11.590

-

-

-

Parana Technologies

USA . 1,127 parts In-Stock

1+ parts

$17.164

100+ parts

-

1k+ parts

$17.379

10k+ parts

-

1,127

$17.164

-

$17.379

-

DigiPath Technology Company

USA . 341 parts In-Stock

1+ parts

$18.899

100+ parts

$17.387

1k+ parts

-

10k+ parts

-

341

$18.899

$17.387

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-

ChromeModa Solutions

Germany . 4,357 parts In-Stock

1+ parts

$19.285

100+ parts

$15.814

1k+ parts

-

10k+ parts

-

4,357

$19.285

$15.814

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-

IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$19.285

100+ parts

$18.321

1k+ parts

$17.356

10k+ parts

-

1,549

$19.285

$18.321

$17.356

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Corphita

USA . 2,021 parts In-Stock

1+ parts

$122.298

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

$122.298

-

-

-

Microchip USA

USA . 1,796 parts In-Stock

1+ parts

$160.260

100+ parts

$155.980

1k+ parts

$153.850

10k+ parts

$151.710

1,796

$160.260

$155.980

$153.850

$151.710

Ampacity Inc.

Singapore . 4,470 parts In-Stock

1+ parts

$251.390

100+ parts

-

1k+ parts

-

10k+ parts

-

4,470

$251.390

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-

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Technical Specifications

Digital-to-Analog Converters DAC38RF90IAAV attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

1 ns

Maximum Supply Current:

1.758 A

Sample Rate:

9000 MHz

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

1.3 V

Maximum Analog Output Voltage:

2.3 V

Nominal Negative Supply Voltage:

-1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

144

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.031 in (0.8 mm)

Terminal Finish:

Tin Silver Copper

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Fine Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Trade Compliance

DAC38RF90IAAV Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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