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DAC37J82IAAV

Texas Instruments

DAC37J82IAAV by Texas Instruments

The Texas Instruments DAC37J82IAAV is a 16-bit D/A converter with a max analog output voltage of ±0.6V and sample rate of 1600MHz. It features CMOS technology, industrial temperature grade, and parallel input format. Ideal for applications requiring high-speed digital-to-analog conversion in industrial settings.

Median Price

$78.444

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,298 parts In-Stock

1+ parts

$60.668

100+ parts

$53.927

1k+ parts

$39.652

10k+ parts

-

14,298

$60.668

$53.927

$39.652

-

Mouser Electronics

USA . 127 parts In-Stock

1+ parts

$96.220

100+ parts

$74.180

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-

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127

$96.220

$74.180

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 510 parts In-Stock

1+ parts

$57.635

100+ parts

-

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510

$57.635

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Vyrian

USA . 4,485 parts In-Stock

1+ parts

-

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4,485

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Cyclops Electronics Ltd

UK . 13 parts In-Stock

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13

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Prism Electronics

USA . 1 parts In-Stock

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1

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 469 parts In-Stock

1+ parts

$4.962

100+ parts

$460.774

1k+ parts

$4.466

10k+ parts

-

469

$4.962

$460.774

$4.466

-

DigiPath Technology Company

USA . 589 parts In-Stock

1+ parts

$5.464

100+ parts

$5.026

1k+ parts

-

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589

$5.464

$5.026

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-

ChromeModa Solutions

Germany . 1,211 parts In-Stock

1+ parts

$5.575

100+ parts

$4.572

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-

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1,211

$5.575

$4.572

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IDEA Electronic Components Group

UK . 127 parts In-Stock

1+ parts

$5.575

100+ parts

-

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$5.018

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127

$5.575

-

$5.018

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Native Components

USA . 782 parts In-Stock

1+ parts

$13.540

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782

$13.540

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Northwest PG Solutions

USA . 1,305 parts In-Stock

1+ parts

$14.894

100+ parts

$13.405

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1,305

$14.894

$13.405

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Corphita

USA . 1,529 parts In-Stock

1+ parts

$54.601

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1,529

$54.601

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Authorized Procurement Solutions

USA . 34,000 parts In-Stock

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34,000

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A-Z Elektronik GmbH

Germany . 5,040 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,360 parts In-Stock

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Lixinc

USA . 3,020 parts In-Stock

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3,020

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Experience unparalleled precision and performance with the Texas Instruments DAC37J82IAAV digital-to-analog converter. Crafted by a renowned manufacturer, this cutting-edge device offers a wide range of applications in various industries. Elevate your projects with its high-quality output voltage and lightning-fast settling time. With a compact package style and advanced technology, this converter delivers exceptional value and benefits to customers seeking top-notch solutions for their electronic designs. Trust Texas Instruments for reliability, innovation, and superior performance.

Feature Benefit Bullets

Maximum Analog Output Voltage: 0.6 V

High maximum analog output voltage allows for a wide range of output signals, making this product versatile for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and reducing assembly time.

No. of Bits: 16

With 16 bits, this digital-to-analog converter provides high precision and resolution in converting digital signals to analog output.

Nominal Settling Time (tstl): 0.01 us

The fast nominal settling time ensures rapid response and accuracy in converting digital signals to analog output.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand a wide range of temperatures, making it suitable for harsh operating conditions.

Sample Rate: 1600 MHz

The high sample rate allows for fast and accurate conversion of digital signals to analog output, making it suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high reliability in operation.

Terminal Form: BALL

The ball terminal form provides a secure connection and easy integration into circuit boards, ensuring stable performance.

Input Format: PARALLEL, WORD

Support for parallel and word input formats allows for flexibility in connecting to different digital sources, making it compatible with various systems.

Technical Specifications

Digital-to-Analog Converters DAC37J82IAAV attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10 ns

Sample Rate:

1600 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

.9 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

.6 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

144

Terminal Form:

Terminal Position:

Bottom

Terminal Pitch:

0.031 in (0.8 mm)

Terminal Finish:

Tin Silver Copper

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Trade Compliance

DAC37J82IAAV Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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