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DAC3174IRGCR

Texas Instruments

DAC3174IRGCR by Texas Instruments

DAC3174IRGCR by Texas Instruments is a 14-bit D/A converter with 1V max analog output voltage and 500MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C, has a settling time of 0.011us, and requires power supplies of 1.8V and 3.3V.

Median Price

$27.991

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,503 parts In-Stock

1+ parts

$27.991

100+ parts

$24.881

1k+ parts

$18.295

10k+ parts

-

11,503

$27.991

$24.881

$18.295

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,700 parts In-Stock

1+ parts

$26.591

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

$26.591

-

-

-

Vyrian

USA . 5,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,830

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 218 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

$0.136

218

$0.142

-

-

$0.136

Northwest PG Solutions

USA . 1,635 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

$0.138

1,635

$0.156

-

-

$0.138

AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$13.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$13.970

-

-

-

Parana Technologies

USA . 229 parts In-Stock

1+ parts

$17.119

100+ parts

-

1k+ parts

$17.331

10k+ parts

-

229

$17.119

-

$17.331

-

DigiPath Technology Company

USA . 29 parts In-Stock

1+ parts

$18.850

100+ parts

$17.342

1k+ parts

-

10k+ parts

-

29

$18.850

$17.342

-

-

ChromeModa Solutions

Germany . 2,742 parts In-Stock

1+ parts

$19.235

100+ parts

$15.773

1k+ parts

-

10k+ parts

-

2,742

$19.235

$15.773

-

-

IDEA Electronic Components Group

UK . 1,280 parts In-Stock

1+ parts

$19.235

100+ parts

$18.273

1k+ parts

$17.312

10k+ parts

-

1,280

$19.235

$18.273

$17.312

-

Corphita

USA . 1,202 parts In-Stock

1+ parts

$25.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

$25.192

-

-

-

A-Z Elektronik GmbH

Germany . 6,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,692

-

-

-

-

Alle Elektronik GmbH

Germany . 4,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,461

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-

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Overview

Experience unparalleled quality and precision with the DAC3174IRGCR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-of-the-line Digital-to-Analog Converters that offer exceptional performance and reliability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Trust Texas Instruments to provide you with cutting-edge technology that meets all your needs and exceeds your expectations. Choose the DAC3174IRGCR for superior results every time.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1 V

High maximum analog output voltage allows for a wide range of signal levels to be accurately represented, providing flexibility in signal processing applications.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and facilitating automated assembly processes.

No. of Bits: 14

With a high number of bits, the digital-to-analog converter can provide high resolution and accuracy in converting digital signals to analog voltages.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for versatile use in different electronic systems, catering to various requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand a wide range of environmental conditions, making it suitable for industrial applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer flexibility in mounting and cooling, catering to different design requirements for optimal performance.

Sample Rate: 500 MHz

High sample rate allows for fast conversion of digital signals to analog outputs, enabling real-time processing of high-frequency signals.

Technical Specifications

Digital-to-Analog Converters DAC3174IRGCR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

11 ns

Maximum Supply Current:

130 mA

Sample Rate:

500 MHz

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

1 V

Power Supplies:

1.8,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC3174IRGCR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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