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DAC161S055CISQX

Texas Instruments

DAC161S055CISQX by Texas Instruments

DAC161S055CISQX by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.21V and linearity error of 0.0046%. Ideal for industrial applications, it operates b/w -40 to 105°C, settling in 5us. With serial input format and quad terminal position, this chip carrier package has a very thin profile at 0.8mm seated height.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,260 parts In-Stock

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Digiode

USA . 2,258 parts In-Stock

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AZTECH Wire

Italy . 541 parts In-Stock

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$5.062

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541

$5.062

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Parana Technologies

USA . 1,479 parts In-Stock

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$17.474

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$17.669

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ChromeModa Solutions

Germany . 1,551 parts In-Stock

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$19.634

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$16.100

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

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$19.634

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$18.652

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$17.671

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One Stop Electronics

USA . 931 parts In-Stock

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$23.000

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$23.000

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Component Stockers USA

USA . 334 parts In-Stock

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$99.990

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Corphita

USA . 1,798 parts In-Stock

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DigiPath Technology Company

USA . 877 parts In-Stock

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$17.702

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Native Components

USA . 797 parts In-Stock

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Microchip USA

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Kepictronics

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Northwest PG Solutions

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Overview

Unlock the power of precision and reliability with the DAC161S055CISQX by Texas Instruments. Crafted by a trusted industry leader, this digital-to-analog converter offers seamless integration and unparalleled performance. Ideal for a wide range of applications, this cutting-edge technology delivers superior accuracy and efficiency. Experience the value of top-notch quality and innovation with the DAC161S055CISQX - your ultimate solution for all your analog output needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.21 V

Higher maximum output voltage allows for a wider range of analog signal outputs, making this product versatile for different applications.

No. of Bits: 16

With a high number of bits, this converter offers high resolution and accuracy in converting digital signals to analog, making it suitable for precision applications.

Maximum Linearity Error (EL): 0.0046 %

Low linearity error ensures accurate conversion of digital signals to analog, resulting in reliable and consistent output voltages.

Nominal Settling Time (tstl): 5 us

Fast settling time ensures that the output voltage stabilizes quickly after a change in input signal, making this product suitable for real-time applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Digital-to-Analog Converters DAC161S055CISQX attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0046 %

Nominal Settling Time (tstl):

5 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

.015 V

Maximum Analog Output Voltage:

5.21 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N16

Trade Compliance

DAC161S055CISQX Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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