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CY74FCT374CTSOCTG4

Texas Instruments

CY74FCT374CTSOCTG4 by Texas Instruments

CY74FCT374CTSOCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.2 ns at 5V, suitable for industrial applications. It features a 3-STATE output and operates b/w -40 to 85°C, making it ideal for systems requiring fast signal transmission in harsh environments. With a small outline package style and surface mount capability, this device offers efficient integration into compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,897 parts In-Stock

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Digiode

USA . 626 parts In-Stock

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626

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 650 parts In-Stock

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$0.788

100+ parts

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650

$0.788

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Northwest PG Solutions

USA . 863 parts In-Stock

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$0.867

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$0.867

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Andel Nordic

Denmark . 3,567 parts In-Stock

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$5.454

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$5.236

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$5.236

3,567

$5.454

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$5.236

AZTECH Wire

Italy . 578 parts In-Stock

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$15.502

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Parana Technologies

USA . 2,072 parts In-Stock

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$15.947

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$16.296

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2,072

$15.947

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DigiPath Technology Company

USA . 2,282 parts In-Stock

1+ parts

$17.560

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$16.155

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2,282

$17.560

$16.155

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ChromeModa Solutions

Germany . 5,922 parts In-Stock

1+ parts

$17.918

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$14.693

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$17.918

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IDEA Electronic Components Group

UK . 601 parts In-Stock

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$17.918

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$17.022

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$16.126

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601

$17.918

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$16.126

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One Stop Electronics

USA . 1,145 parts In-Stock

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$43.000

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Component Stockers USA

USA . 507 parts In-Stock

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$99.990

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507

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Microchip USA

USA . 4,004 parts In-Stock

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Corphita

USA . 4,000 parts In-Stock

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Overview

Experience seamless data transmission and reliable performance with the CY74FCT374CTSOCTG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in every product. The bus driver & transceivers category of this versatile chip offers unparalleled efficiency and precision in various applications. Trust in the value and benefits that this product brings, providing customers with a competitive edge and peace of mind in their projects. Elevate your designs with the CY74FCT374CTSOCTG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient utilization of board space and easy alignment during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage of 5V, making it compatible with a wide range of systems and components.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stability and efficient signal transmission in various applications.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable performance and compatibility with standard power sources.

No. of Terminals: 20

Sufficient number of terminals allow for versatile connectivity options and easy integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs and enables compact designs in electronic systems.

Maximum I (ol): 64 Amp

High output current capability of 64A allows for driving power-hungry loads with ease, enhancing the product's versatility.

Propagation Delay (tpd): 5.2 ns

Low propagation delay ensures minimal signal delay, making this product suitable for real-time applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85°C ensures reliable performance in harsh environmental conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for flexibility in controlling the output signal, making it suitable for multiplexing applications.

Trigger Type: POSITIVE EDGE

Positive edge trigger type enables precise timing control, making it ideal for synchronous communication and data transfer.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in cold environments, expanding the product's usability.

Terminal Position: DUAL

Dual terminal position provides multiple connection options, allowing for versatile installation and compatibility with different PCB layouts.

No. of Ports: 2

Two ports offer connectivity for multiple devices or channels, enhancing the product's ability to interface with various components.

Maximum Seated Height: 2.65 mm

Low seated height of 2.65mm allows for compact PCB design and minimizes component interference in tight spaces.

Width: 7.5 mm

Narrow width of 7.5mm facilitates dense PCB layouts and enables space-efficient integration in electronic systems.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, making this product suitable for applications requiring precise signal processing.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage of 4.75V allows for operation in low-power scenarios, extending the product's compatibility range.

Length: 12.8 mm

Compact length of 12.8mm contributes to a space-saving design and facilitates integration into smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of this product.

Terminal Form: GULL WING

Gull wing terminal form provides robust solder connections for reliable electrical connections and mechanical strength.

Packing Method: TR

TR packing method offers efficient packaging and handling during production and distribution processes, ensuring product integrity.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm allows for compatibility with common PCB layouts and facilitates easy integration into existing designs.

Maximum Supply Voltage (Vsup): 5.25 V

Safe maximum supply voltage of 5.25V protects the device from overvoltage conditions, ensuring reliable operation and longevity.

Technical Specifications

Bus Driver & Transceivers CY74FCT374CTSOCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT374CTSOCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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