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CY74FCT373CTSOCG4

Texas Instruments

CY74FCT373CTSOCG4 by Texas Instruments

CY74FCT373CTSOCG4 by Texas Instruments is an 8-bit bus driver with 3-STATE output. It has a propagation delay of 5.5 ns at 5V, making it ideal for industrial applications requiring fast signal transmission. With a small outline package style and dual terminal position, it offers efficient surface mount installation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,152 parts In-Stock

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Digiode

USA . 838 parts In-Stock

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838

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Distributors (Availability)

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Native Components

USA . 763 parts In-Stock

1+ parts

$0.615

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763

$0.615

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Northwest PG Solutions

USA . 1,922 parts In-Stock

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$0.676

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1,922

$0.676

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One Stop Electronics

USA . 361 parts In-Stock

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$5.000

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361

$5.000

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Parana Technologies

USA . 2,127 parts In-Stock

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$11.249

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$11.684

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2,127

$11.249

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$11.684

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ChromeModa Solutions

Germany . 4,065 parts In-Stock

1+ parts

$12.639

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$10.364

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4,065

$12.639

$10.364

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IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$12.639

100+ parts

$12.007

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$11.375

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572

$12.639

$12.007

$11.375

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AZTECH Wire

Italy . 396 parts In-Stock

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$15.015

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$15.015

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Component Stockers USA

USA . 730 parts In-Stock

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$99.990

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730

$99.990

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Microchip USA

USA . 3,908 parts In-Stock

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Corphita

USA . 608 parts In-Stock

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DigiPath Technology Company

USA . 300 parts In-Stock

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$11.395

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300

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$11.395

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Overview

Experience the superior quality and reliability of Texas Instruments with the CY74FCT373CTSOCG4 bus driver & transceiver. This versatile component offers customers a seamless solution for their electronic designs, boasting a fast propagation delay, low power consumption, and 3-state output characteristics. Whether you're looking to drive buses or control transceivers, this product provides unmatched value and performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various industrial environments.

Propagation Delay At Nominal Supply: 4.7 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for applications requiring quick data transfer.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it a convenient choice for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal transmission, contributing to the reliability and precision of the product.

Technical Specifications

Bus Driver & Transceivers CY74FCT373CTSOCG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT373CTSOCG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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