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CY74FCT2374CTSOCE4

Texas Instruments

CY74FCT2374CTSOCE4 by Texas Instruments

Texas Instruments' CY74FCT2374CTSOCE4 is an 8-bit bus driver with a propagation delay of 5.2 ns at 5V, suitable for industrial applications. It features a 3-STATE output with series resistor, operates b/w -40 to 85°C, and has a max seated height of 2.65 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,182 parts In-Stock

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Digiode

USA . 2,514 parts In-Stock

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Native Components

USA . 512 parts In-Stock

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$0.140

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$0.134

512

$0.140

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$0.134

Northwest PG Solutions

USA . 10 parts In-Stock

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$0.153

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-

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$0.135

10

$0.153

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$0.135

Andel Nordic

Denmark . 610 parts In-Stock

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$5.698

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$5.470

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$5.470

610

$5.698

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$5.470

$5.470

AZTECH Wire

Italy . 278 parts In-Stock

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$11.852

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Parana Technologies

USA . 2,337 parts In-Stock

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$27.249

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$33.686

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One Stop Electronics

USA . 717 parts In-Stock

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$28.000

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$28.000

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ChromeModa Solutions

Germany . 4,215 parts In-Stock

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$30.617

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$25.106

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$30.617

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$29.086

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$27.555

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QUARKTWIN TECHNOLOGY LTD

USA . 13,378 parts In-Stock

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Microchip USA

USA . 4,429 parts In-Stock

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DigiPath Technology Company

USA . 2,159 parts In-Stock

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Corphita

USA . 819 parts In-Stock

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Overview

Enhance your electronic circuits with the CY74FCT2374CTSOCE4 by Texas Instruments, a top-quality Bus Driver & Transceiver perfect for a wide range of applications. With Texas Instrument's reputation for excellence in manufacturing, you can trust that this product delivers exceptional performance and reliability. Offering 8 bits and 3-state output characteristics, this small outline package provides a fast propagation delay of 5.2 ns, making it ideal for industrial-grade projects. Upgrade your designs with the CY74FCT2374CTSOCE4 and experience the value and benefits this advanced technology brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for internal components and ensures durability, making the product long-lasting.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

No. of Bits: 8

Provides sufficient data transfer capability for a range of applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement allows for compatibility with common power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable and efficient operation.

Power Supplies (V): 5

Consistent power supply ensures reliable performance.

No. of Terminals: 20

Sufficient terminals for connections and interfaces with other components.

Package Style (Meter): SMALL OUTLINE

Compact package design saves space and allows for easy integration into various systems.

Maximum I (ol): 12 Amp

High maximum output current capability for driving loads or bus lines.

Propagation Delay (tpd): 5.2 ns

Low propagation delay ensures minimal delay in signal transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor for controlled and efficient signal output.

Trigger Type: POSITIVE EDGE

Positive edge trigger for precise timing control.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments.

Terminal Position: DUAL

Dual terminal position for flexibility in mounting and connection options.

No. of Ports: 2

Multiple ports for versatile connectivity options.

Maximum Seated Height: 2.65 mm

Low profile design for space-saving installation.

Width: 7.5 mm

Compact width for easy integration into tight spaces.

Output Polarity: TRUE

True output polarity for accurate signal representation.

Minimum Supply Voltage (Vsup): 4.75 V

Wide supply voltage range for flexibility in power source selection.

Length: 12.8 mm

Compact length for space-efficient installation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable performance in harsh conditions.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Packing Method: TUBE

Convenient tube packaging for easy handling and storage.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.25 V

Wide supply voltage range for flexibility in power source selection.

Technical Specifications

Bus Driver & Transceivers CY74FCT2374CTSOCE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT2374CTSOCE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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