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CY74FCT2373TQCTG4

Texas Instruments

CY74FCT2373TQCTG4 by Texas Instruments

CY74FCT2373TQCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 8 ns at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max seated height of 1.75 mm. Ideal for applications requiring fast signal transmission and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,937 parts In-Stock

1+ parts

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6,937

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Digiode

USA . 1,468 parts In-Stock

1+ parts

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1,468

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 200 parts In-Stock

1+ parts

$2.714

100+ parts

-

1k+ parts

$2.606

10k+ parts

$2.606

200

$2.714

-

$2.606

$2.606

Parana Technologies

USA . 1,368 parts In-Stock

1+ parts

$9.433

100+ parts

-

1k+ parts

$10.050

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1,368

$9.433

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$10.050

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DigiPath Technology Company

USA . 125 parts In-Stock

1+ parts

$10.387

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125

$10.387

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ChromeModa Solutions

Germany . 2,326 parts In-Stock

1+ parts

$10.599

100+ parts

$8.691

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-

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2,326

$10.599

$8.691

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

1+ parts

$10.599

100+ parts

$10.069

1k+ parts

$9.539

10k+ parts

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2,119

$10.599

$10.069

$9.539

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AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$12.513

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275

$12.513

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One Stop Electronics

USA . 1,242 parts In-Stock

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$59.000

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1,242

$59.000

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Corphita

USA . 3,573 parts In-Stock

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3,573

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Northwest PG Solutions

USA . 796 parts In-Stock

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$4.637

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796

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$4.637

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Native Components

USA . 716 parts In-Stock

1+ parts

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$4.590

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716

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$4.590

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Microchip USA

USA . 434 parts In-Stock

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434

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Overview

Unlock the power of seamless data transmission with the CY74FCT2373TQCTG4 by Texas Instruments. Crafted with precision and quality, this bus driver & transceiver is designed to elevate your electronic projects to new heights. Perfect for a wide range of applications, this product offers unparalleled performance, reliability, and efficiency. Experience the benefits of fast propagation delay, low power consumption, and high output characteristics. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your design with the CY74FCT2373TQCTG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and lightweight, making it easier to handle and transport.

Propagation Delay At Nominal Supply: 8 ns

The low propagation delay at nominal supply ensures fast and efficient data transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuits, reducing assembly time and cost.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, ideal for applications where board space is limited.

No. of Bits: 8

With 8 bits, this bus driver & transceiver is capable of handling a wide range of data signals, making it versatile for multiple applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard electronic systems, ensuring easy integration and compatibility.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes signal distortion and ensures accurate data transmission, making this product reliable in high-speed communication scenarios.

Power Supplies (V): 5

Having a power supply of 5V simplifies the power requirements and compatibility with other components in the system.

No. of Terminals: 20

With 20 terminals, this product provides ample connectivity options for various input and output signals, enhancing its versatility in different applications.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a compact footprint, making it suitable for applications with limited board space while ensuring efficient heat dissipation.

Maximum I (ol): 12 Amp

The high maximum output current of 12A allows the product to drive multiple loads simultaneously without overheating or performance degradation.

Propagation Delay (tpd): 13 ns

The low propagation delay ensures fast signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial applications where heat dissipation is crucial.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor configuration offers flexibility in managing bus lines, allowing for efficient signal routing and isolation when needed.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40°C to 85°C ensures reliable performance in harsh environmental conditions, making this product suitable for industrial and automotive applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved connection stability, enhancing the overall reliability of the product.

No. of Ports: 2

With 2 ports, this product allows for simultaneous communication with multiple devices, enhancing its versatility and connectivity options.

Maximum Seated Height: 1.75 mm

The low maximum seated height ensures compatibility with compact electronic devices and facilitates easier design integration.

Width: 3.9 mm

The slim width of 3.9mm enables a space-efficient design, making it suitable for applications where board space is limited.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other standard logic components, simplifying system design and integration.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement of 4.75V ensures compatibility with a wide range of power sources, making the product versatile and flexible in different system configurations.

Length: 8.65 mm

The compact length of 8.65mm helps in space-saving design and facilitates easy integration into electronic circuits with limited board space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh environmental conditions and operate reliably in rugged settings.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and ease of assembly, improving the overall reliability and longevity of the product.

Packing Method: TR

The TR packing method ensures safe and secure transportation of the product, protecting it from damage during shipping and handling.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm provides high-density mounting capability, enabling compact PCB layouts and efficient use of board space.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V ensures the product's robustness against voltage spikes and fluctuations, enhancing its reliability in unpredictable power conditions.

Technical Specifications

Bus Driver & Transceivers CY74FCT2373TQCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CY74FCT2373TQCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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