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CY74FCT2373ATQCTE4

Texas Instruments

CY74FCT2373ATQCTE4 by Texas Instruments

CY74FCT2373ATQCTE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.2 ns and operates at a supply voltage of 5V. It features a small outline package, dual terminal position, and industrial temperature grade suitable for various applications requiring fast signal transmission in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,179 parts In-Stock

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Digiode

USA . 1,752 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 955 parts In-Stock

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$0.710

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$0.710

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Northwest PG Solutions

USA . 1,912 parts In-Stock

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$0.780

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$0.780

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Parana Technologies

USA . 108 parts In-Stock

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$9.119

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$9.771

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108

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DigiPath Technology Company

USA . 874 parts In-Stock

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$10.041

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$9.238

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874

$10.041

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ChromeModa Solutions

Germany . 2,354 parts In-Stock

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$10.246

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$8.402

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$10.246

$8.402

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IDEA Electronic Components Group

UK . 126 parts In-Stock

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$10.246

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$9.734

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$9.221

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$10.246

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AZTECH Wire

Italy . 267 parts In-Stock

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$16.039

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One Stop Electronics

USA . 1,479 parts In-Stock

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Component Stockers USA

USA . 270 parts In-Stock

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$99.990

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Corphita

USA . 3,591 parts In-Stock

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Microchip USA

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Overview

Upgrade your electronic systems with the CY74FCT2373ATQCTE4 by Texas Instruments, a top-quality bus driver and transceiver designed to deliver reliable performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product offers unmatched precision and durability. Ideal for a wide range of applications, this versatile component ensures seamless data transmission and efficient operation. Invest in the CY74FCT2373ATQCTE4 today and experience the superior quality, value, and benefits that Texas Instruments is known for delivering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility, making the product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal transmission, making the product efficient for high-speed data communication.

Surface Mount: YES

Surface mount capability offers easy installation and soldering, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-efficient design, ideal for applications with limited board space.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage compatibility ensures easy integration with existing systems and components.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and signal integrity in various operating conditions.

Power Supplies (V): 5

Consistent power supply voltage ensures reliability and consistent performance of the product.

No. of Terminals: 20

Sufficient number of terminals offer flexibility in connection options, accommodating different circuit configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design optimize board space utilization and allow for high-density mounting.

Maximum I (ol): 12 Amp

High output current capability supports robust signal transmission and driving of connected devices.

Propagation Delay (tpd): 8.5 ns

Minimal propagation delay ensures fast signal propagation and reduced latency in data transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable performance in varying environmental conditions and temperature extremes.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor offers flexibility in signal control and helps prevent signal contention in multi-driver systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in cold environments and temperature fluctuations.

Terminal Position: DUAL

Dual terminal position facilitates easy and secure connection, ensuring stable electrical contact and signal transmission.

No. of Ports: 2

Multiple ports offer versatility in signal routing and connectivity options, enhancing the product's compatibility with different systems.

Maximum Seated Height: 1.75 mm

Low seated height profile enables compact and space-saving design, suitable for applications with height restrictions.

Width: 3.9 mm

Narrow width dimension allows for efficient board space utilization and compact system integration.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and polarity consistency in data communication.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage requirement allows for flexible power supply options while ensuring stable operation.

Length: 8.65 mm

Compact length dimension supports space-efficient designs and enables versatile placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures reliable operation in harsh industrial environments and extended temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various CMOS logic devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connection to PCBs, ensuring reliable electrical contact.

Packing Method: TR

TR packing method provides protection and convenience for transportation, storage, and handling of the product.

Terminal Pitch: 0.635 mm

Optimal terminal pitch allows for efficient and precise soldering, ensuring reliable electrical connections and signal transmission.

Maximum Supply Voltage (Vsup): 5.25 V

High maximum supply voltage tolerance accommodates variations in power supply voltage, ensuring stable operation and protection against overvoltage conditions.

Technical Specifications

Bus Driver & Transceivers CY74FCT2373ATQCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CY74FCT2373ATQCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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