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CY74FCT2244TSOCTE4

Texas Instruments

CY74FCT2244TSOCTE4 by Texas Instruments

The Texas Instruments CY74FCT2244TSOCTE4 is a 2-bit bus driver with 6.5ns propagation delay, ideal for industrial applications. It operates at a nominal voltage of 5V and features 3-state output characteristics with a max I (ol) of 12A. This surface-mount device comes in a small outline package, making it suitable for compact designs requiring fast signal transmission.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,690 parts In-Stock

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Digiode

USA . 3,501 parts In-Stock

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3,501

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Distributors (Availability)

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AZTECH Wire

Italy . 883 parts In-Stock

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$7.457

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883

$7.457

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Andel Nordic

Denmark . 767 parts In-Stock

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$7.832

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$7.519

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$7.519

767

$7.832

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$7.519

$7.519

Parana Technologies

USA . 463 parts In-Stock

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$17.671

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$17.861

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463

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$19.458

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ChromeModa Solutions

Germany . 2,320 parts In-Stock

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$19.855

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$16.281

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2,320

$19.855

$16.281

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

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$19.855

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$18.862

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$17.870

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1,962

$19.855

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$17.870

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One Stop Electronics

USA . 455 parts In-Stock

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$39.000

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Microchip USA

USA . 4,966 parts In-Stock

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Corphita

USA . 3,662 parts In-Stock

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Northwest PG Solutions

USA . 1,060 parts In-Stock

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$4.617

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Native Components

USA . 770 parts In-Stock

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$4.570

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770

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Overview

Elevate your electronic designs with the CY74FCT2244TSOCTE4 by Texas Instruments, a top-tier manufacturer known for delivering exceptional quality and reliability. As a leading product in the Bus Driver & Transceivers category, this versatile component offers unmatched performance and functionality. Whether you're working on industrial automation, telecommunications, or consumer electronics, this 3-STATE with series resistor output driver provides superior value and efficiency. Trust Texas Instruments to power your innovations and bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term use.

Propagation Delay At Nominal Supply: 6.5 ns

The low propagation delay ensures fast and efficient signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space in the overall design of the circuit.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the input/output characteristics and performance of the product in a given circuit.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable and stable operation of the bus driver & transceiver.

No. of Terminals: 20

Having multiple terminals allows for easy connectivity with other components and peripherals in the system.

Maximum I (ol): 12 Amp

The high output current capability of 12A ensures that the product can drive loads with ease, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C enables the product to operate reliably in various environmental conditions.

Technical Specifications

Bus Driver & Transceivers CY74FCT2244TSOCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT2244TSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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