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CVMEH22501AMDGGREP

Texas Instruments

CVMEH22501AMDGGREP by Texas Instruments

Texas Instruments CVMEH22501AMDGGREP is an 8-bit bus driver with a propagation delay of 13.8 ns at 3.3V, suitable for military applications. It features a small outline package with dual terminals and operates b/w -55 to 125 °C, making it ideal for bidirectional control systems.

Median Price

$7.362

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,443 parts In-Stock

1+ parts

$6.937

100+ parts

$5.655

1k+ parts

$3.770

10k+ parts

-

8,443

$6.937

$5.655

$3.770

-

Rochester

USA . 280 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

280

-

$6.230

$5.580

$5.250

DigiKey

USA . 280 parts In-Stock

1+ parts

-

100+ parts

$8.200

1k+ parts

-

10k+ parts

-

280

-

$8.200

-

-

Verical

USA . 280 parts In-Stock

1+ parts

-

100+ parts

$7.787

1k+ parts

$6.975

10k+ parts

$6.563

280

-

$7.787

$6.975

$6.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,039 parts In-Stock

1+ parts

$5.719

100+ parts

-

1k+ parts

-

10k+ parts

-

1,039

$5.719

-

-

-

DigiKey Marketplace

USA . 2,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,432

-

-

-

-

Vyrian

USA . 2,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,387

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 833 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

$0.216

833

$0.226

-

-

$0.216

Northwest PG Solutions

USA . 1,068 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

10k+ parts

$0.219

1,068

$0.248

-

-

$0.219

Andel Nordic

Denmark . 1,330 parts In-Stock

1+ parts

$3.451

100+ parts

-

1k+ parts

$3.313

10k+ parts

$3.313

1,330

$3.451

-

$3.313

$3.313

Component Stockers USA

USA . 11,702 parts In-Stock

1+ parts

$5.350

100+ parts

$5.030

1k+ parts

$4.030

10k+ parts

-

11,702

$5.350

$5.030

$4.030

-

Corphita

USA . 2,570 parts In-Stock

1+ parts

$5.418

100+ parts

-

1k+ parts

-

10k+ parts

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2,570

$5.418

-

-

-

Parana Technologies

USA . 1,755 parts In-Stock

1+ parts

$21.663

100+ parts

-

1k+ parts

$22.083

10k+ parts

-

1,755

$21.663

-

$22.083

-

IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$24.340

100+ parts

$23.123

1k+ parts

$21.906

10k+ parts

-

2,188

$24.340

$23.123

$21.906

-

ChromeModa Solutions

Germany . 436 parts In-Stock

1+ parts

$24.340

100+ parts

$19.959

1k+ parts

-

10k+ parts

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436

$24.340

$19.959

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-

QUARKTWIN TECHNOLOGY LTD

USA . 15,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,827

-

-

-

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DigiPath Technology Company

USA . 1,025 parts In-Stock

1+ parts

-

100+ parts

$21.945

1k+ parts

-

10k+ parts

-

1,025

-

$21.945

-

-

Overview

Enhance your electronics projects with the CVMEH22501AMDGGREP by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a Bus Driver & Transceiver component, this product offers seamless integration and optimal performance in a variety of applications. With a focus on value and innovation, Texas Instruments delivers a product that exceeds expectations, providing customers with unmatched benefits and advantages. Upgrade your designs with confidence using this cutting-edge solution from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 13.8 ns

Low propagation delay ensures fast signal transmission, making the product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and layouts, optimizing space and design flexibility.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage ensures stable and consistent performance of the product, maintaining reliability during operation.

Maximum I (ol): 12 Amp

High output current capability allows for driving multiple loads or devices, enhancing the product's versatility and functionality.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing and synchronization of signals, reducing the likelihood of errors or data corruption.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures the product can withstand harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers CVMEH22501AMDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

VME

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

13.8 ns

Propagation Delay (tpd):

13.8 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

CVMEH22501AMDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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