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CLVC1G17MDCKREPG4

Texas Instruments

CLVC1G17MDCKREPG4 by Texas Instruments

CLVC1G17MDCKREPG4 by Texas Instruments is a CMOS Logic Gate with 5.5 ns Propagation Delay, suitable for military-grade applications. It operates at 3.3V with a load capacitance of 50pF and features Schmitt Trigger technology, making it ideal for high-speed signal processing in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,702 parts In-Stock

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Digiode

USA . 2,646 parts In-Stock

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2,646

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Distributors (Availability)

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Native Components

USA . 706 parts In-Stock

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$1.414

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706

$1.414

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Northwest PG Solutions

USA . 1,110 parts In-Stock

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$1.555

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$1.555

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AZTECH Wire

Italy . 447 parts In-Stock

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$15.619

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One Stop Electronics

USA . 920 parts In-Stock

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$20.000

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920

$20.000

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Parana Technologies

USA . 1,462 parts In-Stock

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$21.659

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$22.076

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$21.659

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DigiPath Technology Company

USA . 239 parts In-Stock

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$23.849

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$21.941

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239

$23.849

$21.941

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ChromeModa Solutions

Germany . 1,321 parts In-Stock

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$24.336

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$19.956

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IDEA Electronic Components Group

UK . 245 parts In-Stock

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$24.336

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$23.119

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$21.902

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Component Stockers USA

USA . 390 parts In-Stock

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$99.990

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Kepictronics

USA . 8,210 parts In-Stock

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Corphita

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Overview

Experience top-notch quality and performance with the CLVC1G17MDCKREPG4 by Texas Instruments, a leading manufacturer in the industry. This logic gate offers unparalleled reliability and precision, making it an essential component for various applications. From consumer electronics to industrial machinery, this product provides unmatched value and efficiency to customers, ensuring seamless operations and optimal functionality. Upgrade your projects with this cutting-edge solution and experience the superior advantages it brings to the table. Trust Texas Instruments for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the logic gate, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures quick response time and efficient signal processing in the logic gate.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

Ideal load capacitance of 50 pF supports efficient operation and signal transmission within the logic gate.

Power Supplies (V): 3.3

Consistent power supply voltage of 3.3V ensures stable performance of the logic gate in various applications.

No. of Terminals: 5

Having 5 terminals allows for easy connectivity and integration within electronic circuits.

Maximum I (ol): 24 Amp

High maximum output current of 24A enables the logic gate to drive larger loads without compromising performance.

Propagation Delay (tpd): 11 ns

Low propagation delay of 11 ns ensures fast signal processing and high-speed operation of the logic gate.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliability and performance in challenging environments.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature (-55°C) allows for use in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and longevity for the logic gate.

Schmitt Trigger: YES

Inclusion of a Schmitt trigger allows for signal conditioning and noise immunity, enhancing the overall performance of the logic gate.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable operation of the logic gate.

Terminal Form: GULL WING

Gull wing terminal form provides secure connection and easy soldering during installation of the logic gate.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a small outline, thin profile, and shrink pitch saves space and allows for dense PCB layouts.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connectivity options for the logic gate.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1 mm allows for slim and compact design of electronic devices incorporating the logic gate.

Width: 1.25 mm

Narrow width of 1.25 mm enables the logic gate to be used in space-constrained applications without compromising functionality.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage of 1.65V allows for operation in power-constrained systems while maintaining performance.

Maximum Time At Peak Reflow Temperature (s): 30

High maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C enables secure and lasting solder joints during the assembly process.

Length: 2 mm

Compact length of 2 mm allows for versatile placement and integration of the logic gate in various electronic devices.

Temperature Grade: MILITARY

Military-grade temperature range and performance specifications ensure durability and reliability in harsh environmental conditions.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm facilitates precise soldering and connection of the logic gate in high-density PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5V allows for compatibility with a wide range of electronic systems and applications.

Technical Specifications

Logic Gates CLVC1G17MDCKREPG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

CLVC1G17MDCKREPG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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