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CDCE949PWRG4

Texas Instruments

CDCE949PWRG4 by Texas Instruments

CDCE949PWRG4 by Texas Instruments is a clock generator with a max output frequency of 230MHz, operating b/w -40 to 85°C. It has 24 terminals in a small outline package suitable for industrial applications like video peripherals due to its CMOS technology and low supply current of 38mA at 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,456 parts In-Stock

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Digiode

USA . 1,459 parts In-Stock

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1,459

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Resion

USA . 162 parts In-Stock

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162

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AZTECH Wire

Italy . 264 parts In-Stock

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$11.905

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264

$11.905

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Parana Technologies

USA . 655 parts In-Stock

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$15.817

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$16.176

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One Stop Electronics

USA . 1,039 parts In-Stock

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$16.000

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$16.000

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ChromeModa Solutions

Germany . 2,468 parts In-Stock

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$17.772

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$14.573

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$17.772

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IDEA Electronic Components Group

UK . 296 parts In-Stock

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$17.772

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$16.883

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$15.995

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$17.772

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$15.995

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Advanced Electronics

New Zealand . 44 parts In-Stock

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$29.868

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$27.180

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$24.492

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Corohmni

South Africa . 595 parts In-Stock

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$46.470

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A-Z Elektronik GmbH

Germany . 5,024 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,349 parts In-Stock

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Corphita

USA . 2,625 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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DigiPath Technology Company

USA . 1,549 parts In-Stock

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$16.023

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Microchip USA

USA . 1,375 parts In-Stock

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Northwest PG Solutions

USA . 708 parts In-Stock

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$3.631

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$3.631

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Native Components

USA . 73 parts In-Stock

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$3.594

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Overview

Enhance your electronic designs with the CDCE949PWRG4 clock generator by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance and reliability in generating clock signals up to 230 MHz. Ideal for a wide range of applications, from networking equipment to industrial automation, this clock generator provides seamless synchronization and timing control. Elevate your projects with the quality and value that Texas Instruments brings to the table, ensuring optimal functionality and efficiency every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Efficient use of space on the PCB.

Maximum Output Clock Frequency: 230 MHz

High clock frequency for demanding applications.

Power Supplies (V): 1.8

Low power consumption, efficient operation.

No. of Terminals: 24

Allows for versatile connectivity options.

Maximum Seated Height: 1.2 mm

Low profile design for compact devices.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High quality terminal finish for reliable connections.

Technology: CMOS

Low power consumption and high noise immunity.

Nominal Primary Clock/Crystal Frequency: 32 MHz

Standard clock frequency for compatibility with other devices.

Technical Specifications

Clock Generators CDCE949PWRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

230 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Nominal Primary Clock/Crystal Frequency:

32 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

CDCE949PWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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