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NB3V63143G00MNR2G

Onsemi

NB3V63143G00MNR2G by Onsemi

NB3V63143G00MNR2G clock generator by Onsemi operates at a max output frequency of 200MHz with a supply voltage range of 1.7V to 1.9V. Ideal for industrial applications, this CMOS technology chip carrier features 16 terminals in a square package style, suitable for surface mount assembly.

Median Price

$2.196

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,287 parts In-Stock

1+ parts

$2.179

100+ parts

$2.102

1k+ parts

$2.044

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-

1,287

$2.179

$2.102

$2.044

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Arrow

USA . 1,287 parts In-Stock

1+ parts

$2.346

100+ parts

$2.203

1k+ parts

$2.096

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-

1,287

$2.346

$2.203

$2.096

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Verical

USA . 1,287 parts In-Stock

1+ parts

-

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$2.203

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$2.096

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1,287

-

$2.203

$2.096

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Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.840

100

-

$2.190

$1.960

$1.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,124 parts In-Stock

1+ parts

$2.070

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1,124

$2.070

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Vyrian

USA . 2,589 parts In-Stock

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2,589

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Ampacity Inc.

Singapore . 569 parts In-Stock

1+ parts

$1.850

100+ parts

-

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569

$1.850

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Corphita

USA . 2,010 parts In-Stock

1+ parts

$1.961

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2,010

$1.961

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Corohmni

South Africa . 489 parts In-Stock

1+ parts

$2.179

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489

$2.179

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Microchip USA

USA . 5,144 parts In-Stock

1+ parts

$16.036

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5,144

$16.036

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AZTECH Wire

Italy . 451 parts In-Stock

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$17.930

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451

$17.930

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Aztec Data Supply Inc.

USA . 3,867 parts In-Stock

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$18.453

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3,867

$18.453

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Kulean Microsystems

USA . 7,308 parts In-Stock

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Problanco Electronics

Mexico . 4,449 parts In-Stock

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Argo Parts USA

USA . 4,230 parts In-Stock

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Continental Prestige Electronics

USA . 4,199 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,662 parts In-Stock

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TANS Electronics

Latvia . 2,371 parts In-Stock

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2,371

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Aranea Global

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 181 parts In-Stock

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Overview

Elevate your electronic designs with the NB3V63143G00MNR2G by Onsemi, a top-notch clock generator that delivers unparalleled quality and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this clock generator is ideal for a wide range of applications. With a sleek and compact design, this surface-mountable device boasts a maximum output clock frequency of 200 MHz, making it perfect for industrial-grade projects. Experience seamless performance and precision timing with the NB3V63143G00MNR2G, providing you with exceptional value and unmatched benefits for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.9 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Package Shape: SQUARE

The square package shape can facilitate efficient placement on the PCB, maximizing use of available space.

Maximum Output Clock Frequency: 200 MHz

The high output clock frequency enables this clock generator to support high-speed operations in various electronic devices.

No. of Terminals: 16

The 16 terminals provide versatile connectivity options, allowing for integration with different components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers enhanced thermal management and space-saving benefits.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures efficient power consumption and operation at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature provides reliability and stability even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures functionality in both extreme cold and hot conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of Nickel Gold Palladium terminal finish offers excellent conductivity and durability, improving the lifespan of the product.

Terminal Position: QUAD

The quad terminal position allows for efficient connection and communication with other components, enhancing overall system performance.

Maximum Seated Height: 1 mm

The low maximum seated height enables a slim and compact design, ideal for space-constrained applications.

Width: 3 mm

The narrow width of 3 mm offers compatibility with standard PCB designs and allows for efficient placement in crowded layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly without damaging the component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable soldering and mounting on PCBs for robust connections.

Length: 3 mm

The compact length of 3 mm complements the overall slim design, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, offering durability and performance in demanding conditions.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator peripheral IC type, combined with other functionalities, provides versatile clock signal generation capabilities for diverse electronic applications.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of soldering errors during installation.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides stable and efficient power delivery, ensuring reliable performance in various applications.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for high-density mounting on PCBs, saving space and enabling compact system designs.

Nominal Primary Clock/Crystal Frequency: 50 MHz

The nominal primary clock/crystal frequency of 50 MHz offers standard clock signal generation capabilities suitable for a wide range of electronic devices.

Technical Specifications

Clock Generators NB3V63143G00MNR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

SINGLE ENDED CLOCK INPUT RANGE 3 MHZ TO 200 MHZ

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

50 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

NB3V63143G00MNR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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