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CDCE706PWRG4

Texas Instruments

CDCE706PWRG4 by Texas Instruments

CDCE706PWRG4 clock generator by Texas Instruments operates at a max frequency of 300 MHz with 20 terminals. It has a supply voltage range of 3-3.6 V, suitable for industrial applications requiring precise timing such as video peripherals. The compact rectangular package is surface-mountable and features BICMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,329 parts In-Stock

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Digiode

USA . 2,370 parts In-Stock

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Cyclops Electronics Ltd

UK . 15 parts In-Stock

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AZTECH Wire

Italy . 388 parts In-Stock

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$11.824

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$11.824

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One Stop Electronics

USA . 376 parts In-Stock

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$12.000

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Parana Technologies

USA . 578 parts In-Stock

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$38.260

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$39.537

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$35.979

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$32.420

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Corohmni

South Africa . 364 parts In-Stock

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$41.176

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DigiPath Technology Company

USA . 538 parts In-Stock

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$42.129

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$38.759

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ChromeModa Solutions

Germany . 2,277 parts In-Stock

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$42.989

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$35.251

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IDEA Electronic Components Group

UK . 1,603 parts In-Stock

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$42.989

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$40.840

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$38.690

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Component Stockers USA

USA . 1,586 parts In-Stock

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Native Components

USA . 639 parts In-Stock

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$89.340

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$85.766

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Northwest PG Solutions

USA . 926 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,444 parts In-Stock

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Lixinc

USA . 5,245 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,296 parts In-Stock

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Corphita

USA . 2,547 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision timing with the CDCE706PWRG4 by Texas Instruments. Crafted with expertise and quality materials, this clock generator is designed to deliver seamless performance for a wide range of applications. From industrial to video peripherals, this innovative technology offers customers unmatched reliability, efficiency, and flexibility. Experience the superior value and benefits that this product brings to your projects, setting you apart from the competition with its exceptional capabilities. Trust Texas Instruments for cutting-edge solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and cost-effective assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Can support a wide range of supply voltages, providing flexibility in different applications.

Maximum Output Clock Frequency: 300 MHz

High output clock frequency enables fast data processing and high-performance applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range of -40 to 85°C.

Technology: BICMOS

Utilizes BiCMOS technology for improved speed, power efficiency, and integration capabilities.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, ensuring compatibility.

Technical Specifications

Clock Generators CDCE706PWRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

200 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

CDCE706PWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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