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CDCE431YS

Texas Instruments

CDCE431YS by Texas Instruments

CDCE431YS by Texas Instruments is a clock generator with a max output frequency of 1100 MHz, suitable for industrial applications. Operating at temperatures from -40 to 85 °C, it has a supply voltage range of 3-3.6 V and comes in an unencased chip package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,068 parts In-Stock

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Digiode

USA . 2,122 parts In-Stock

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Native Components

USA . 162 parts In-Stock

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$0.965

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$0.965

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Northwest PG Solutions

USA . 1,164 parts In-Stock

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$1.061

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One Stop Electronics

USA . 555 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 518 parts In-Stock

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$8.963

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Microchip USA

USA . 1,270 parts In-Stock

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$32.230

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$31.770

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$31.540

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$31.310

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$31.310

Parana Technologies

USA . 917 parts In-Stock

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$76.768

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Corohmni

South Africa . 1,132 parts In-Stock

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DigiPath Technology Company

USA . 728 parts In-Stock

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$84.531

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ChromeModa Solutions

Germany . 6,103 parts In-Stock

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$70.730

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IDEA Electronic Components Group

UK . 1,227 parts In-Stock

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$86.256

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$81.943

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$77.630

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Component Stockers USA

USA . 733 parts In-Stock

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Corphita

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Overview

Upgrade your clock generator with the CDCE431YS by Texas Instruments, known for its top-notch quality and reliability. Perfect for a wide range of applications, this surface mount chip offers a maximum output clock frequency of 1100 MHz, ensuring precision timing in any industrial setting. With a nominal supply voltage of 3.3 V and a temperature grade of INDUSTRIAL, you can trust this clock generator to deliver superior performance under any conditions. Experience the value and benefits this product brings to your projects, simplifying your design process and boosting efficiency. Trust Texas Instruments to provide the innovative solutions you need.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility and compatibility with a wide range of systems and power sources.

Maximum Output Clock Frequency: 1100 MHz

High maximum output clock frequency allows for the generation of high-speed clock signals, suitable for demanding applications.

Package Style (Meter): UNCASED CHIP

Uncased chip package style offers simplicity and compactness, making it ideal for space-constrained designs.

Minimum Supply Voltage: 3 V

A low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Position: UPPER

Upper terminal position simplifies connections and integration into circuit layouts, enhancing ease of use.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Dedicated clock generator functionality with additional features makes this product versatile and suitable for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and mounting processes, improving manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

Close match between nominal supply voltage and actual supply voltage ensures stable and reliable operation.

Nominal Primary Clock/Crystal Frequency: 38.33 MHz

Nominal primary clock/crystal frequency provides a standard reference frequency for synchronization and timing applications.

Technical Specifications

Clock Generators CDCE431YS attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

1100 MHz

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

38.33 MHz

Qualification:

Not Qualified

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

CDCE431YS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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