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CDC3244DBLE

Texas Instruments

CDC3244DBLE by Texas Instruments

CDC3244DBLE by Texas Instruments is a 20-terminal bus driver with 4.1ns propagation delay, operating at 3.3V. It features dual terminals and enables low control type, suitable for industrial applications requiring 3-STATE output characteristics. The device is surface mountable and has a max operating temperature of 85°C, making it ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,075 parts In-Stock

1+ parts

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8,075

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Digiode

USA . 156 parts In-Stock

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156

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 521 parts In-Stock

1+ parts

$0.098

100+ parts

-

1k+ parts

-

10k+ parts

$0.094

521

$0.098

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-

$0.094

Northwest PG Solutions

USA . 1,921 parts In-Stock

1+ parts

$0.107

100+ parts

-

1k+ parts

-

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$0.095

1,921

$0.107

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-

$0.095

One Stop Electronics

USA . 1,523 parts In-Stock

1+ parts

$10.000

100+ parts

-

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1,523

$10.000

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AZTECH Wire

Italy . 650 parts In-Stock

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$13.495

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650

$13.495

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Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

$25.431

100+ parts

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1k+ parts

$26.064

10k+ parts

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1,542

$25.431

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$26.064

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$28.574

100+ parts

$27.145

1k+ parts

$25.717

10k+ parts

-

2,193

$28.574

$27.145

$25.717

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ChromeModa Solutions

Germany . 1,970 parts In-Stock

1+ parts

$28.574

100+ parts

$23.431

1k+ parts

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1,970

$28.574

$23.431

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DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

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$25.762

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2,371

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$25.762

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Corphita

USA . 265 parts In-Stock

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265

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Overview

Experience unparalleled quality and reliability with the CDC3244DBLE by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Bus Driver & Transceiver, this product offers exceptional value and benefits to customers across various applications. With its high-speed performance and advanced features, the CDC3244DBLE ensures seamless data transmission, making it an essential component for any electronic design project. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications in various environments.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable, the product offers easy installation and saves space on the PCB, making it convenient for compact designs.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying circuit design and reducing overall cost.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, the product is power-efficient and compatible with common power supply systems.

Maximum I (ol): 64 Amp

With a high maximum output current capacity, the product can drive larger loads without the need for external amplification, enhancing its versatility.

Output Characteristics: 3-STATE

The 3-STATE output allows the product to provide multiple output states, adding flexibility in controlling connected devices or circuits.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the product can withstand harsh environmental conditions, ensuring reliable operation in demanding applications.

Technical Specifications

Bus Driver & Transceivers CDC3244DBLE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.1 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

CDC3244DBLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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