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CD74HCT574QM96Q1

Texas Instruments

CD74HCT574QM96Q1 by Texas Instruments

CD74HCT574QM96Q1 by Texas Instruments is an 8-bit bus driver with 3-STATE output, operating at a max frequency of 20MHz. It has a supply voltage range of 4.5V to 5.5V and can handle a load capacitance of 50pF. Designed for automotive applications, it meets AEC-Q100 screening standards and operates in temperatures ranging from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,302 parts In-Stock

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Digiode

USA . 2,130 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 738 parts In-Stock

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$0.837

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738

$0.837

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Northwest PG Solutions

USA . 1,737 parts In-Stock

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$0.921

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$0.921

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Andel Nordic

Denmark . 4,978 parts In-Stock

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$4.137

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$3.972

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$3.972

4,978

$4.137

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$3.972

AZTECH Wire

Italy . 873 parts In-Stock

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$19.776

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873

$19.776

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Parana Technologies

USA . 1,745 parts In-Stock

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$27.683

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$38.775

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1,745

$27.683

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$38.775

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DigiPath Technology Company

USA . 1,447 parts In-Stock

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$30.482

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$28.043

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1,447

$30.482

$28.043

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ChromeModa Solutions

Germany . 992 parts In-Stock

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$31.104

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$25.505

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992

$31.104

$25.505

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IDEA Electronic Components Group

UK . 81 parts In-Stock

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$31.104

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$29.549

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$27.994

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81

$31.104

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$27.994

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One Stop Electronics

USA . 397 parts In-Stock

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$51.000

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397

$51.000

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Corphita

USA . 3,189 parts In-Stock

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Microchip USA

USA . 325 parts In-Stock

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Overview

Enhance your automotive electronic designs with the CD74HCT574QM96Q1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver & transceiver is perfect for various applications, providing seamless integration and exceptional performance. With a small outline package style and 3-STATE output characteristics, this product offers high value and benefits to customers seeking efficiency and precision in their projects. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the bus driver & transceiver, making it suitable for rugged automotive applications.

No. of Bits: 8

Having 8 bits allows for efficient data transmission and communication between devices in the automotive system, providing the necessary connectivity for various functions.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard automotive power systems, making integration easier and more convenient.

Propagation Delay (tpd): 50 ns

With a low propagation delay of 50 ns, this bus driver & transceiver ensures fast and responsive data transmission, critical for real-time applications in automotive environments.

Maximum Frequency At Nominal Supply: 20000000 Hz

The high maximum frequency capability at the nominal supply voltage of 20MHz enables efficient data processing and communication, meeting the performance requirements of automotive systems.

Technical Specifications

Bus Driver & Transceivers CD74HCT574QM96Q1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CD74HCT574QM96Q1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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