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CD74HCT4046AM

Texas Instruments

CD74HCT4046AM by Texas Instruments

CD74HCT4046AM by Texas Instruments is a Phase Locked Loop (PLL) IC with 16 terminals, operating voltage of 4.5-5.5V, and temperature range of -55 to 125°C. It is ideal for frequency synthesis circuits in military-grade applications due to its CMOS technology and small outline package design.

Median Price

$0.698

Lifecycle Status

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27

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1k+

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Mouser Electronics

USA . 863 parts In-Stock

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DigiKey

USA . 176 parts In-Stock

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Rochester

USA . 4,095 parts In-Stock

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Verical

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Arrow

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Freelance Electronics

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Ozdisan Elektronik

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Nova Conductors

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Digiode

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Legend Electronics Inc.

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NAC Semi

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Flex Direct, LLC

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QIE Inc.

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PC Components Company LLC

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Mil-Aero Solutions, Inc.

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Semicontronic

India . 1,339 parts In-Stock

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$0.468

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$0.456

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Corphita

USA . 3,575 parts In-Stock

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Corohmni

South Africa . 19 parts In-Stock

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Microchip USA

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 3,941 parts In-Stock

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IDEA Electronic Components Group

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Argo Parts USA

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Supply Digital

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GreenTree Electronics

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Netroflash

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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Overview

Unlock the power of precision frequency synthesis with the CD74HCT4046AM by Texas Instruments. Designed for Phase Locked Loops (PLL) applications, this small outline package offers top-notch quality and reliability. With a wide temperature range and military-grade technology, it's perfect for demanding environments. Experience seamless frequency control and stable performance with this versatile component. Elevate your projects with Texas Instruments' renowned expertise in semiconductor manufacturing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and effort in production.

Nominal Supply Voltage (Vsup): 5 V

Operates at a commonly used voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, suitable for environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable in noisy environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HCT4046AM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HCT4046AM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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