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CD74HCT32ME4

Texas Instruments

CD74HCT32ME4 by Texas Instruments

CD74HCT32ME4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 36 ns and operates at a nominal voltage of 5V. This small outline package is commonly used in military applications due to its temperature grade and moisture sensitivity level.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,258 parts In-Stock

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Digiode

USA . 1,488 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 773 parts In-Stock

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$19.144

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773

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One Stop Electronics

USA . 1,096 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,778 parts In-Stock

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$24.003

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$24.660

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DigiPath Technology Company

USA . 2,061 parts In-Stock

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$26.431

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$26.431

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ChromeModa Solutions

Germany . 1,877 parts In-Stock

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$26.970

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$22.115

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$26.970

$22.115

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

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$26.970

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$25.622

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$24.273

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$24.273

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Ampacity Inc.

Singapore . 952 parts In-Stock

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$57.000

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Microchip USA

USA . 4,195 parts In-Stock

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Perfect Parts

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Upgrade your logic gate game with the high-quality CD74HCT32ME4 by Texas Instruments. As a leading manufacturer, Texas Instruments ensures top-notch performance and reliability in all their products. The CD74HCT32ME4 boasts a compact design, making it suitable for various applications. With its 4 functions and 2 inputs, it offers versatility and flexibility. Experience fast propagation delay of only 36ns, ensuring efficient operation. Its small outline package and surface mount capability make installation a breeze. Trust Texas Instruments to deliver exceptional value and benefits with the CD74HCT32ME4. Unleash the power of this logic gate and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product lightweight and durable, ensuring its reliability in various applications.

Propagation Delay At Nominal Supply:

36 ns - With a low propagation delay, this product offers fast response times, making it suitable for high-speed electronic circuits.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation, saving time and effort in the assembly process.

No. of Functions:

4 - With multiple functions integrated into a single package, this product offers cost-effectiveness and space-saving benefits.

No. of Inputs:

2 - Having a sufficient number of inputs enables versatile circuit configurations, providing flexibility in designing complex logic systems.

Package Shape:

RECTANGULAR - The rectangular shape of this package offers compatibility with standard mounting equipment, facilitating its integration into various circuit board layouts.

Nominal Supply Voltage / Vsup (V):

5 - The 5V nominal supply voltage ensures compatibility with common power sources, making this product widely applicable in different electronic systems.

Load Capacitance (CL):

50 pF - The specified load capacitance allows for accurate determination of the required external circuit parameters, enabling optimal performance of the logic gates.

Power Supplies (V):

5 - The power supply voltage of 5V ensures compatibility with commonly available power sources, making this product suitable for a wide range of applications.

No. of Terminals:

14 - The generous number of terminals provides flexibility in connecting various input and output signals, facilitating the integration of this product into complex circuitry.

Package Style (Meter):

SMALL OUTLINE - The small outline package style offers space-saving advantages, allowing for compact circuit designs with reduced board real estate requirements.

Maximum I (ol):

4 Amp - The high maximum output current capability of 4 Amps ensures robust signal handling, making this product suitable for driving loads with higher current demands.

Propagation Delay (tpd):

36 ns - The low propagation delay ensures minimal signal delay throughout the logic circuit, contributing to enhanced overall system performance.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows this product to operate reliably even in demanding environments with elevated temperatures.

Minimum Operating Temperature:

55 °C - The wide range of operating temperatures makes this product suitable for both extreme cold and hot conditions, ensuring its versatility in various applications.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The specified terminal finish offers excellent corrosion resistance and low contact resistance, ensuring reliable electrical connections and prolonged product lifespan.

Terminal Position:

DUAL - The dual terminal position enables ease of soldering and mechanical stability, minimizing the chances of connectivity issues and ensuring reliable operation.

Maximum Seated Height:

1.75 mm - The low maximum seated height of this product allows for compatibility with space-restricted environments, providing flexibility in circuit board layout design.

Width:

3.9 mm - The compact width of this product contributes to efficient utilization of board space, enabling high-density circuit designs.

Minimum Supply Voltage (Vsup):

4.5 V - The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, allowing for flexibility in different applications.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures the product's suitability for lead-free soldering processes, complying with environmental standards and regulations.

Length:

8.65 mm - The length of this product is optimized for easy integration and compatibility with standard mounting equipment, facilitating seamless circuit board assembly.

Temperature Grade:

MILITARY - The specified military temperature grade ensures the product's reliability and performance even under stringent conditions and extreme temperature variations.

Technology:

CMOS - The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it a reliable and versatile choice.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical stability and secure solder connections, ensuring reliable electrical performance in a variety of applications.

Packing Method:

TUBE - The tube packing method allows for efficient storage, transportation, and organization of the product, ensuring product integrity during handling and delivery.

Terminal Pitch:

1.27 mm - The specified terminal pitch offers compatibility with standard PCB designs and enables easy soldering, ensuring convenience and reliability in circuit assembly.

Moisture Sensitivity Level (MSL):

1 - The low moisture sensitivity level ensures the product's resistance to moisture-related damage during storage and handling, increasing its overall lifespan.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage capability makes this product suitable for versatile power sources, providing flexibility in different application scenarios.

Maximum Power Supply Current (ICC):

0.04 mA - The low maximum power supply current consumption results in energy-efficient operation, reducing power consumption and enabling longer battery life for portable devices.

Technical Specifications

Logic Gates CD74HCT32ME4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HCT32ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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