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CD74HC86M96

Texas Instruments

CD74HC86M96 by Texas Instruments

CD74HC86M96 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 36 ns at 4.5V, suitable for military-grade applications requiring fast response times. This small outline package with surface mount capability is ideal for compact electronic designs.

Median Price

$0.445

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,972 parts In-Stock

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$0.200

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$0.200

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$0.190

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Texas Instruments

USA . 29,655 parts In-Stock

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$0.419

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$0.285

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$0.146

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29,655

$0.419

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Arrow

USA . 1,301 parts In-Stock

1+ parts

$0.471

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$0.253

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$0.199

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1,301

$0.471

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$0.199

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Mouser Electronics

USA . 4,814 parts In-Stock

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$0.480

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$0.302

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$0.269

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$0.205

4,814

$0.480

$0.302

$0.269

$0.205

DigiKey

USA . 2,533 parts In-Stock

1+ parts

$0.480

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$0.262

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$0.223

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$0.203

2,533

$0.480

$0.262

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$0.203

Verical

USA . 1,301 parts In-Stock

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$0.253

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$0.199

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1,301

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$0.253

$0.199

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Distributors (In-Stock)

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Vyrian

USA . 2,574 parts In-Stock

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$0.233

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2,574

$0.233

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Voyager Components

USA . 1,835 parts In-Stock

1+ parts

$0.285

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$0.285

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$0.285

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$0.285

1,835

$0.285

$0.285

$0.285

$0.285

Digiode

USA . 4,221 parts In-Stock

1+ parts

$0.398

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4,221

$0.398

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TME

Poland . 804 parts In-Stock

1+ parts

$0.690

100+ parts

$0.373

1k+ parts

$0.317

10k+ parts

$0.292

804

$0.690

$0.373

$0.317

$0.292

R&J Components

USA . 10,960 parts In-Stock

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Bristol Electronics

USA . 3,228 parts In-Stock

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$0.374

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$0.184

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$0.150

3,228

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$0.374

$0.184

$0.150

Dan-Mar Components

USA . 3,228 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,755 parts In-Stock

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Nova Conductors

Japan . 16 parts In-Stock

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EMSNET

USA . 9 parts In-Stock

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LWI Electronics Inc

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Corphita

USA . 74 parts In-Stock

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$0.377

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74

$0.377

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Parana Technologies

USA . 835 parts In-Stock

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$13.647

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$14.149

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835

$13.647

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DigiPath Technology Company

USA . 701 parts In-Stock

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$15.027

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$13.825

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701

$15.027

$13.825

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ChromeModa Solutions

Germany . 5,282 parts In-Stock

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$15.334

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$12.574

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IDEA Electronic Components Group

UK . 1,469 parts In-Stock

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$15.334

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$14.567

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$13.801

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QUARKTWIN TECHNOLOGY LTD

USA . 21,095 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 6,838 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,354 parts In-Stock

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Glotronic Ltd.

UK . 5,083 parts In-Stock

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Supply Digital

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Assy Fe

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Authorized Procurement Solutions

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Netroflash

USA . 100 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments CD74HC86M96 Logic Gates. Crafted with precision and expertise, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this logic gate offers unparalleled performance and reliability. Unlock the potential of your projects with the CD74HC86M96's fast propagation delay and low power consumption. Trust in Texas Instruments to bring you cutting-edge technology that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product durable and resistant to environmental factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 36 ns

The low propagation delay at nominal supply voltage ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability offers easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V nominal supply voltage provides a balanced power input for efficient operation and compatibility with various systems.

No. of Inputs: 2

Having 2 inputs allows for logical operations between two different signals, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, making it suitable for industrial and military applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable for various applications.

Technical Specifications

Logic Gates CD74HC86M96 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC86M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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