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CD74HC4511PWRG4

Texas Instruments

CD74HC4511PWRG4 by Texas Instruments

CD74HC4511PWRG4 by Texas Instruments is a 7-bit decoder with 60ns propagation delay, suitable for military applications. It operates at a nominal voltage of 4.5V and has a max power supply current of 0.16mA. With surface mount capability and latched input conditioning, it offers efficient decoding solutions in compact designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,168 parts In-Stock

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Vyrian

USA . 2,016 parts In-Stock

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Native Components

USA . 805 parts In-Stock

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$1.684

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$1.684

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Northwest PG Solutions

USA . 1,627 parts In-Stock

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$1.853

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AZTECH Wire

Italy . 303 parts In-Stock

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$6.140

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Parana Technologies

USA . 1,310 parts In-Stock

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$14.379

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$14.823

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$15.833

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$14.566

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ChromeModa Solutions

Germany . 5,980 parts In-Stock

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$16.156

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$13.248

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

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$15.348

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$14.540

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One Stop Electronics

USA . 679 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the potential of your electronic projects with the CD74HC4511PWRG4 by Texas Instruments. This high-quality decoder and driver offers unmatched reliability and performance, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this product delivers precise output control and efficient operation. Trust in Texas Instruments to provide superior technology that meets your needs and exceeds your expectations. Experience the value and benefits of the CD74HC4511PWRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 60 ns

Fast propagation delay ensures quick signal processing, making this decoder and driver suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Input Conditioning: LATCHED

Latched input conditioning helps in stabilizing the input signals, ensuring reliable and accurate data processing.

No. of Bits: 7

The 7-bit configuration provides flexibility in addressing multiple inputs/outputs, making this decoder and driver versatile for various applications.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance and power consumption, enhancing the overall functionality of the product.

Load Capacitance (CL): 50 pF

Suitable load capacitance for stable operation and minimal signal distortion, ensuring reliable data transmission.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the decoder and driver to function reliably in various environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the decoder and driver can operate in cold environments, increasing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder and driver efficient and reliable in digital systems.

Technical Specifications

Decoder & Drivers CD74HC4511PWRG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

7

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

60 ns

Propagation Delay (tpd):

405 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC4511PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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