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CD74HC241M96E4

Texas Instruments

CD74HC241M96E4 by Texas Instruments

CD74HC241M96E4 by Texas Instruments is a 20-terminal bus driver with 33ns propagation delay, suitable for military applications. It features 2 functions, operates at -55 to 125 °C, and has a max supply voltage of 6V. The device supports true output polarity and has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,365 parts In-Stock

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Digiode

USA . 3,855 parts In-Stock

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3,855

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Distributors (Availability)

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Andel Nordic

Denmark . 3,451 parts In-Stock

1+ parts

$2.645

100+ parts

-

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$2.539

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$2.539

3,451

$2.645

-

$2.539

$2.539

AZTECH Wire

Italy . 450 parts In-Stock

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$4.919

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$4.919

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Native Components

USA . 651 parts In-Stock

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$7.920

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651

$7.920

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Northwest PG Solutions

USA . 717 parts In-Stock

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$8.712

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$7.841

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717

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Parana Technologies

USA . 2,247 parts In-Stock

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$15.399

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$15.785

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$15.399

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$15.785

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DigiPath Technology Company

USA . 641 parts In-Stock

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$16.956

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641

$16.956

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ChromeModa Solutions

Germany . 4,542 parts In-Stock

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$17.302

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$14.188

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

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$17.302

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$16.437

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$15.572

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$17.302

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$15.572

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One Stop Electronics

USA . 1,080 parts In-Stock

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$31.000

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$31.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,518 parts In-Stock

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Perfect Parts

USA . 1,829 parts In-Stock

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Microchip USA

USA . 1,292 parts In-Stock

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Corphita

USA . 1,254 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the CD74HC241M96E4 by Texas Instruments, a top-tier manufacturer known for its quality products. As a leading player in the Bus Driver & Transceivers category, this product offers unmatched performance and efficiency. With its 3-STATE output characteristics and TRUE output polarity, it is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile component guarantees smooth operation and high-speed connectivity. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing customers with value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material helps in ensuring the longevity and portability of the product.

Propagation Delay At Nominal Supply: 33 ns

Fast propagation delay allows for quick data transmission and efficient performance.

Surface Mount: YES

Surface mount capability makes installation and assembly easy and convenient.

No. of Functions: 2

Having multiple functions in one product provides versatility and functionality.

Nominal Supply Voltage / Vsup (V): 4.5

Efficient power supply voltage ensures optimal performance without excessive power consumption.

Load Capacitance (CL): 50 pF

Proper load capacitance ensures stable and reliable signal transmission.

Power Supplies (V): 2/6

Support for multiple power supply voltages allows flexibility in different operating environments.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures ensures durability and reliability even in challenging conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Bus Driver & Transceivers CD74HC241M96E4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW OUTPUT ENABLES

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CD74HC241M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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