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CD74HC164M

Texas Instruments

CD74HC164M by Texas Instruments

CD74HC164M by Texas Instruments is an 8-bit digital shift register with a propagation delay of 38ns at 4.5V supply, suitable for military-grade applications. It operates on a supply voltage range of 2-6V, has a max frequency of 20MHz, and features positive edge triggering. The package is surface mountable and has a small outline design with Gull Wing terminals.

Median Price

$0.750

Lifecycle Status

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Chip1Stop

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DigiKey

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Rochester

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Verical

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Maritex

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Digiode

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

USA . 314 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

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Netroflash

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Supply Digital

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Overview

Upgrade your digital shift register game with the CD74HC164M by Texas Instruments. Designed with precision and reliability in mind, this product offers top-notch quality that you can trust. Perfect for a wide range of applications, this digital shift register boasts fast propagation delay and true output polarity, ensuring seamless performance. With Texas Instruments at the helm, you can expect nothing but excellence. Elevate your projects today with the CD74HC164M and experience the unparalleled value and benefits it brings to the table.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the shift register, making it suitable for various electronic applications.

Propagation Delay At Nominal Supply : 38 ns

Low propagation delay ensures quick and efficient data transfer within the shift register, improving overall system performance.

Surface Mount : YES

Surface mount capability allows for easy and space-efficient integration of the shift register onto PCBs, simplifying the manufacturing process.

No. of Bits : 8

8 bits provide sufficient data storage capacity for many basic digital applications, making this shift register suitable for a wide range of projects.

Nominal Supply Voltage / Vsup (V) : 4.5

A moderate nominal supply voltage of 4.5V offers a good balance between power consumption and performance in electronic systems.

Trigger Type : POSITIVE EDGE

Positive edge triggering allows precise control over when data is transferred or latched into the shift register, enabling accurate synchronization in digital circuits.

Maximum Frequency At Nominal Supply : 20,000,000 Hz

High maximum frequency capability of 20MHz enables fast data processing and clock speeds, making this shift register suitable for high-speed applications.

Technology : CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this shift register versatile and energy-efficient.

Technical Specifications

Digital Shift Registers CD74HC164M attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Register

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

CD74HC164M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-387-3916, 5962013873916

NIIN

013873916

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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