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CD74HC151M96E4

Texas Instruments

CD74HC151M96E4 by Texas Instruments

CD74HC151M96E4 by Texas Instruments is an 8-input multiplexer with a propagation delay of 43ns. It operates at a nominal voltage of 4.5V and has a max operating temperature of 125°C. Ideal for military-grade applications requiring fast signal switching in compact designs.

Median Price

$26.734

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$26.734

100+ parts

$24.328

1k+ parts

$21.922

10k+ parts

-

3,000

$26.734

$24.328

$21.922

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,117 parts In-Stock

1+ parts

$25.397

100+ parts

-

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2,117

$25.397

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-

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Vyrian

USA . 6,845 parts In-Stock

1+ parts

-

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6,845

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Nova Conductors

Japan . 93 parts In-Stock

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93

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Distributors (Availability)

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AZTECH Wire

Italy . 976 parts In-Stock

1+ parts

$14.560

100+ parts

-

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976

$14.560

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$18.947

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-

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130

$18.947

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Ampacity Inc.

Singapore . 2,577 parts In-Stock

1+ parts

$22.720

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2,577

$22.720

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Corphita

USA . 344 parts In-Stock

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$24.061

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-

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344

$24.061

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Parana Technologies

USA . 1,873 parts In-Stock

1+ parts

$25.604

100+ parts

-

1k+ parts

$26.218

10k+ parts

-

1,873

$25.604

-

$26.218

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$26.734

100+ parts

$24.328

1k+ parts

$21.922

10k+ parts

-

3,000

$26.734

$24.328

$21.922

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DigiPath Technology Company

USA . 1,228 parts In-Stock

1+ parts

$28.194

100+ parts

$25.938

1k+ parts

-

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1,228

$28.194

$25.938

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ChromeModa Solutions

Germany . 5,135 parts In-Stock

1+ parts

$28.769

100+ parts

$23.591

1k+ parts

-

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5,135

$28.769

$23.591

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$28.769

100+ parts

$27.331

1k+ parts

$25.892

10k+ parts

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837

$28.769

$27.331

$25.892

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Component Stockers USA

USA . 699 parts In-Stock

1+ parts

$99.990

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699

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,982 parts In-Stock

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29,982

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Microchip USA

USA . 4,652 parts In-Stock

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4,652

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Bastille Electronics

Australia . 78 parts In-Stock

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78

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Overview

Experience unparalleled performance and reliability with the CD74HC151M96E4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product they create. This multiplexer & demultiplexer offers a wide range of applications, providing customers with versatile solutions for their projects. With fast propagation delay, low power consumption, and high precision, this product delivers exceptional value and benefits to users. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The plastic/epoxy package body material makes this product lightweight and durable.

Propagation Delay At Nominal Supply:

43 ns - The low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount:

YES - The surface mount feature allows for easy and space-saving installation on printed circuit boards.

No. of Inputs:

8 - With 8 inputs, this multiplexer/demultiplexer can handle multiple signals efficiently.

Package Shape:

RECTANGULAR - The rectangular package shape offers compatibility with standard PCB layouts.

No. of Bits:

8 - An 8-bit design provides versatility and flexibility in signal routing.

Nominal Supply Voltage / Vsup (V):

4.5 - The 4.5V supply voltage ensures compatibility with a wide range of systems.

Load Capacitance (CL):

50 pF - The low load capacitance minimizes signal distortion and ensures accurate output.

Power Supplies (V):

2/6 - Compatibility with 2V and 6V power supplies offers flexibility in system integration.

No. of Terminals:

16 - The 16 terminals provide ample connection options for various input and output configurations.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and allows for high-density circuit designs.

Maximum I (ol):

5.2 Amp - The high output current rating ensures reliable operation under heavy loads.

Propagation Delay (tpd):

280 ns - The 280 ns propagation delay allows for precise signal synchronization in complex systems.

Maximum Operating Temperature:

125 °C - The wide operating temperature range makes this product suitable for extreme environments.

Minimum Operating Temperature:

55 °C - The -55°C minimum operating temperature ensures reliable performance in cold conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position:

DUAL - The dual terminal position allows for easy connection and installation in various orientations.

Maximum Seated Height:

1.75 mm - The low seated height minimizes space requirements and facilitates compact system designs.

Width:

3.9 mm - The 3.9 mm width enables easy integration into narrow spaces and small enclosures.

Output Polarity:

COMPLEMENTARY - The complementary output polarity simplifies signal interpretation and processing.

Minimum Supply Voltage (Vsup):

2 V - The 2V minimum supply voltage ensures compatibility with low-power systems.

Peak Reflow Temperature °C:

260 - The 260°C peak reflow temperature allows for reliable soldering and assembly processes.

Length:

9.9 mm - The 9.9 mm length provides a compact form factor for space-constrained applications.

Temperature Grade:

MILITARY - The military-grade temperature rating ensures reliability in harsh operating conditions.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength and facilitates automated assembly processes.

Packing Method:

TR - The tape and reel packing method simplifies component handling and storage.

Terminal Pitch:

1.27 mm - The 1.27 mm terminal pitch allows for easy connection and facilitates board-level integration.

Maximum Supply Voltage (Vsup):

6 V - The 6V maximum supply voltage provides flexibility in power source selection.

Maximum Power Supply Current (ICC):

0.16 mA - The low power supply current ensures efficient energy usage and minimizes heat dissipation.

Technical Specifications

Multiplexer & Demultiplexer CD74HC151M96E4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC151M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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