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CD74ACT651M96E4

Texas Instruments

CD74ACT651M96E4 by Texas Instruments

CD74ACT651M96E4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 15.5 ns at 5V, featuring a small outline package and dual terminal position. It operates b/w -55 to 125 °C, suitable for military-grade applications requiring independent control and positive edge trigger type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,993 parts In-Stock

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Digiode

USA . 4,047 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 891 parts In-Stock

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$0.812

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891

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Northwest PG Solutions

USA . 924 parts In-Stock

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$0.893

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924

$0.893

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AZTECH Wire

Italy . 335 parts In-Stock

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$9.967

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$9.967

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Parana Technologies

USA . 2,161 parts In-Stock

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$16.067

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$16.404

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$16.067

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DigiPath Technology Company

USA . 1,578 parts In-Stock

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$17.692

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ChromeModa Solutions

Germany . 3,927 parts In-Stock

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$18.053

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$14.803

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

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$18.053

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$17.150

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$16.248

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One Stop Electronics

USA . 1,238 parts In-Stock

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$24.000

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Corohmni

South Africa . 113 parts In-Stock

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$32.093

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Component Stockers USA

USA . 629 parts In-Stock

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$99.990

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Andel Nordic

Denmark . 3,919 parts In-Stock

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$131.817

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$126.544

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Corphita

USA . 4,401 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,489 parts In-Stock

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Microchip USA

USA . 158 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality CD74ACT651M96E4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch Bus Driver & Transceivers that are reliable and efficient. This versatile product is suitable for a wide range of applications, offering customers unmatched value and performance. Experience the benefits of fast propagation delay, small outline package style, 3-STATE output characteristics, and much more. Trust Texas Instruments to provide you with cutting-edge technology that meets your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for use in different environments.

Propagation Delay At Nominal Supply: 15.5 ns

The low propagation delay ensures fast data transmission, making the product efficient and reliable.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves valuable space on the PCB.

Nominal Supply Voltage / Vsup (V): 5

The standard supply voltage of 5V makes it compatible with a wide range of systems and applications.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the output signal, adding versatility to the product.

Temperature Grade: MILITARY

Suitable for use in harsh environments, the military-grade temperature tolerance ensures the product's reliability in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and performance.

Technical Specifications

Bus Driver & Transceivers CD74ACT651M96E4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CD74ACT651M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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