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CD74ACT541MG4

Texas Instruments

CD74ACT541MG4 by Texas Instruments

CD74ACT541MG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.6ns at 5V, suitable for military-grade applications. It features a max I (ol) of 24A, operates in temperatures ranging from -55 to 125°C, and has a package style of small outline.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,139 parts In-Stock

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Vyrian

USA . 2,701 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 26 parts In-Stock

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AZTECH Wire

Italy . 642 parts In-Stock

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$14.102

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642

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Parana Technologies

USA . 1,345 parts In-Stock

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$25.222

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$25.859

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$25.859

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DigiPath Technology Company

USA . 2,210 parts In-Stock

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$27.772

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$25.550

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$27.772

$25.550

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ChromeModa Solutions

Germany . 2,223 parts In-Stock

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$28.339

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$23.238

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$28.339

$23.238

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IDEA Electronic Components Group

UK . 1,502 parts In-Stock

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$28.339

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$26.922

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$25.505

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$26.922

$25.505

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Ampacity Inc.

Singapore . 1,625 parts In-Stock

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$46.000

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One Stop Electronics

USA . 301 parts In-Stock

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$47.000

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Component Stockers USA

USA . 349 parts In-Stock

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$99.990

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Andel Nordic

Denmark . 675 parts In-Stock

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$115.836

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$111.203

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$111.203

675

$115.836

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$111.203

$111.203

QUARKTWIN TECHNOLOGY LTD

USA . 20,807 parts In-Stock

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Continental Prestige Electronics

USA . 4,696 parts In-Stock

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Corphita

USA . 4,458 parts In-Stock

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Microchip USA

USA . 3,892 parts In-Stock

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Argo Parts USA

USA . 2,994 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 50 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 26 parts In-Stock

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Overview

Enhance your electronic designs with the CD74ACT541MG4 from Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Crafted with precision using high-quality materials, this product offers reliable performance and fast propagation delay, making it ideal for a wide range of applications. With its 3-STATE output characteristics and true output polarity, this compact device ensures seamless integration into your projects. Trust Texas Instruments for cutting-edge technology that delivers value and efficiency to customers seeking top-notch electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the product, making it suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 9.6 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed data communication.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the circuit board, making it a convenient choice for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes the product compatible with a wide range of electronic systems and power sources.

Output Characteristics: 3-STATE

The 3-state output feature allows the driver/transceiver to disconnect from the bus, enabling multiple devices to share the same bus without interference, enhancing the versatility of the product.

Technical Specifications

Bus Driver & Transceivers CD74ACT541MG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

9.6 ns

Propagation Delay (tpd):

8.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CD74ACT541MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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