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CD74AC74M96G4

Texas Instruments

CD74AC74M96G4 by Texas Instruments

CD74AC74M96G4 by Texas Instruments is a dual-function latch with 14ns propagation delay, suitable for military-grade applications. It operates at 3.3V/5V with a load capacitance of 50pF and can handle up to 24A max I (ol). This CMOS technology flip-flop has a max frequency of 90MHz and is surface mountable in small outline packaging.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Mouser Electronics

USA . 181 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Vyrian

USA . 3,801 parts In-Stock

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Digiode

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Ashlea Components Ltd

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Holdelec - ElecDif-Pro

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$0.212

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Aranea Global

USA . 2,000 parts In-Stock

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$0.318

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Argo Parts USA

USA . 4,140 parts In-Stock

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Continental Prestige Electronics

USA . 2,492 parts In-Stock

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Component Stockers USA

USA . 121 parts In-Stock

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AZTECH Wire

Italy . 619 parts In-Stock

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Parana Technologies

USA . 2,060 parts In-Stock

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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ChromeModa Solutions

Germany . 2,302 parts In-Stock

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Microchip USA

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Corphita

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Cyclops Electronics Ltd (Excess)

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Overview

Upgrade your electronics with the CD74AC74M96G4 by Texas Instruments, a top-tier manufacturer known for its high-quality components. This versatile latch & flip-flop is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With a small outline package and dual terminals, this product provides excellent value and performance. Take your projects to the next level with the reliability and efficiency of Texas Instruments' CD74AC74M96G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures quick response time for the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Surface mounting capability allows for easy and efficient integration into circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a common supply voltage, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures stable and reliable operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops CD74AC74M96G4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

90000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

110 MHz

Trade Compliance

CD74AC74M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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