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CD74AC574MG4

Texas Instruments

CD74AC574MG4 by Texas Instruments

CD74AC574MG4 by Texas Instruments is an 8-bit bus driver & transceiver with a propagation delay of 15.1 ns and a max frequency of 89 MHz. It is commonly used in military applications due to its temperature grade and moisture sensitivity level.

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Digiode

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AZTECH Wire

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Andel Nordic

Denmark . 471 parts In-Stock

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Ampacity Inc.

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

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Overview

Discover the CD74AC574MG4 by Texas Instruments, a high-quality bus driver and transceiver that offers exceptional value and benefits for your applications. With its compact design and advanced technology, this product ensures reliable performance and efficient signal transmission. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile component is the perfect choice. Experience seamless connectivity and enhanced functionality with the CD74AC574MG4, brought to you by the renowned manufacturer Texas Instruments. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, ensuring its long-lasting performance and resistance to environmental factors.

Propagation Delay At Nominal Supply: 15.1 ns

With a quick propagation delay of 15.1 ns, this product ensures efficient and reliable data transmission, reducing latency and improving overall system performance.

Surface Mount: YES

Being surface mountable, this product offers easy installation and space-saving design, making it suitable for compact applications.

No. of Functions: 1

With a single function, this product simplifies its implementation and operation, ensuring straightforward integration into a wide range of bus driver and transceiver systems.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient utilization of board space, making it an ideal choice for applications with limited area availability.

No. of Bits: 8

Equipped with 8 bits, this product enables the transmission and reception of a significant amount of data simultaneously, enhancing its capabilities in bus driving and transceiver applications.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this product provides reliable and stable power delivery, ensuring consistent functionality within the specified voltage range.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance of this product allows it to effectively drive and communicate with external devices or components, delivering accurate and robust signal transmission.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies, this product offers flexibility in different system setups, making it compatible with a wide range of bus driver and transceiver configurations.

No. of Terminals: 20

With 20 terminals, this product provides multiple connection points, facilitating easy interfacing and reliable signal routing in complex bus driver and transceiver setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product enhances its portability and ease of installation, making it suitable for space-constrained applications.

Maximum I (ol): 24 Amp

The impressive maximum output current capability of 24 Amp enables this product to drive demanding loads effectively, ensuring efficient and reliable data transmission.

Propagation Delay (tpd): 135 ns

With a propagation delay of 135 ns, this product maintains high-speed and low-latency signal propagation, allowing for efficient data transfer in bus driver and transceiver applications.

Maximum Operating Temperature: 125 °C

Capable of operating at a maximum temperature of 125°C, this product can withstand harsh environmental conditions, providing reliable performance in various demanding applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product offer the capability to tristate the output, enabling efficient bus sharing and reducing conflicts in multi-driver systems.

Trigger Type: POSITIVE EDGE

With a positive edge trigger type, this product ensures precise and synchronized signal control, enhancing the overall reliability and accuracy of bus driver and transceiver operations.

Minimum Operating Temperature: -55 °C

Operating effectively at a minimum temperature of -55°C, this product is suitable for use in extreme cold environments, making it a reliable choice for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish of this product provides excellent corrosion resistance and reliable electrical contact, ensuring robust performance over an extended product lifespan.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers versatility in system integration, allowing for various connection options and facilitating flexible layout designs.

No. of Ports: 2

With 2 ports, this product delivers bidirectional communication and facilitates efficient data transfer between multiple devices, making it suitable for bus driving and transceiver applications requiring multiple connections.

Maximum Seated Height: 2.65 mm

With a compact maximum seated height of 2.65 mm, this product enables space-efficient PCB designs and facilitates compact system assemblies.

Width: 7.5 mm

The narrow width of 7.5 mm makes this product suitable for applications with limited space, offering compactness without compromising functionality.

Output Polarity: TRUE

With true output polarity, this product ensures accurate signal representation and compatibility with other system components, enhancing overall system reliability and performance.

Minimum Supply Voltage (Vsup): 1.5 V

Operating reliably at a minimum supply voltage of 1.5V, this product provides flexibility for low-voltage applications, expanding its versatility in various bus driver and transceiver systems.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of enduring a maximum time of 30 seconds at peak reflow temperature, this product offers excellent solderability and facilitates efficient manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature rating of 260°C, this product ensures reliable solder joints and withstands high-temperature assembly processes, guaranteeing robust product quality.

Length: 12.8 mm

The compact length of 12.8 mm contributes to space-efficient system designs, allowing for flexible placement and optimizing overall bus driver and transceiver configurations.

Temperature Grade: MILITARY

Designed and tested to meet military-grade temperature performance requirements, this product ensures exceptional reliability and durability in challenging operating conditions.

Maximum Frequency At Nominal Supply: 89000000 Hz

With a maximum operating frequency of 89,000,000 Hz, this product provides high-speed data transmission capabilities, making it suitable for demanding bus driver and transceiver applications.

Technology: CMOS

Based on CMOS technology, this product offers low power consumption, high noise immunity, and excellent compatibility, ensuring efficient and reliable operation in various system designs.

Terminal Form: GULL WING

Featuring the gull-wing terminal form, this product facilitates easy surface mounting, ensuring secure connections and optimal signal transfer for simplified installation and improved system performance.

Packing Method: TUBE

Packaged in tubes, this product ensures convenient handling, storage, and transportation, simplifying inventory management and facilitating efficient manufacturing processes.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product provides precise and compact terminal spacing, allowing for efficient PCB layout and smooth assembly in bus driver and transceiver systems.

Count Direction: UNIDIRECTIONAL

Offering unidirectional count direction, this product ensures consistent and reliable data transfer in a single direction, enhancing its suitability for applications requiring unidirectional communication.

Control Type: INDEPENDENT CONTROL

With independent control, this product allows individual management and control of connected devices or systems, enabling customized and optimized bus driver and transceiver operations.

Moisture Sensitivity Level (MSL): 1

Featuring a moisture sensitivity level of 1, this product provides excellent resistance to moisture-related damage during storage and assembly, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of withstanding a maximum supply voltage of 5.5V, this product offers flexibility and compatibility with various power supply configurations, ensuring reliable operation in diverse bus driver and transceiver setups.

Maximum Power Supply Current (ICC): 0.16 mA

With a maximum power supply current of 0.16 mA, this product demonstrates low power consumption, contributing to energy efficiency and prolonged battery life in portable bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers CD74AC574MG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

89000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

15.1 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CD74AC574MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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