Loading...

CD74AC573MG4

Texas Instruments

CD74AC573MG4 by Texas Instruments

CD74AC573MG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.9 ns at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal pitch of 1.27mm for surface mount assembly in small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,887

-

-

-

-

Digiode

USA . 527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

527

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Ashlea Components Ltd

UK . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 124 parts In-Stock

1+ parts

$5.687

100+ parts

-

1k+ parts

$5.459

10k+ parts

$5.459

124

$5.687

-

$5.459

$5.459

One Stop Electronics

USA . 1,392 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

$6.000

-

-

-

Parana Technologies

USA . 1,659 parts In-Stock

1+ parts

$10.097

100+ parts

-

1k+ parts

$10.644

10k+ parts

-

1,659

$10.097

-

$10.644

-

DigiPath Technology Company

USA . 1,863 parts In-Stock

1+ parts

$11.118

100+ parts

$10.229

1k+ parts

-

10k+ parts

-

1,863

$11.118

$10.229

-

-

ChromeModa Solutions

Germany . 6,701 parts In-Stock

1+ parts

$11.345

100+ parts

$9.303

1k+ parts

-

10k+ parts

-

6,701

$11.345

$9.303

-

-

IDEA Electronic Components Group

UK . 501 parts In-Stock

1+ parts

$11.345

100+ parts

$10.778

1k+ parts

$10.210

10k+ parts

-

501

$11.345

$10.778

$10.210

-

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$14.402

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$14.402

-

-

-

Ampacity Inc.

Singapore . 639 parts In-Stock

1+ parts

$62.000

100+ parts

-

1k+ parts

-

10k+ parts

-

639

$62.000

-

-

-

Component Stockers USA

USA . 481 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

481

$99.990

-

-

-

Microchip USA

USA . 1,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,108

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Corphita

USA . 313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

313

-

-

-

-

Overview

Looking for a reliable bus driver and transceiver for your electronic projects? Look no further than the CD74AC573MG4 by Texas Instruments. With a focus on quality and innovation, Texas Instruments sets the standard in the industry. This versatile component is perfect for applications requiring efficient data transfer. Experience seamless communication with the 8-bit CD74AC573MG4, offering a range of benefits such as fast propagation delay, low power consumption, and compatibility with various supply voltages. Trust Texas Instruments to deliver top-notch performance and reliability, making your projects a success every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a good balance of durability and cost-effectiveness for the product.

Propagation Delay At Nominal Supply: 11.9 ns

Low propagation delay ensures fast and efficient signal transmission in the bus driver & transceivers.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes it compatible with a wide range of systems and power supplies.

Output Characteristics: 3-STATE

3-state output allows for bus contention control and efficient communication in the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Technical Specifications

Bus Driver & Transceivers CD74AC573MG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

11.9 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

CD74AC573MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20