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CD74AC541M96G4

Texas Instruments

CD74AC541M96G4 by Texas Instruments

CD74AC541M96G4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.9ns at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal pitch of 1.27mm for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Adafruit Industries

USA . 200 parts In-Stock

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Vyrian

USA . 7,208 parts In-Stock

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Andel Nordic

Denmark . 4,037 parts In-Stock

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$3.257

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$3.127

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$3.127

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AZTECH Wire

Italy . 679 parts In-Stock

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$10.952

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Parana Technologies

USA . 2,284 parts In-Stock

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$11.718

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$12.110

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DigiPath Technology Company

USA . 534 parts In-Stock

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$12.903

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$11.870

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ChromeModa Solutions

Germany . 6,525 parts In-Stock

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$13.166

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$10.796

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IDEA Electronic Components Group

UK . 2,366 parts In-Stock

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$12.508

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$11.849

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Corohmni

South Africa . 110 parts In-Stock

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Semicontronic

India . 200 parts In-Stock

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$37.050

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$36.860

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Ampacity Inc.

Singapore . 200 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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Bastille Electronics

Australia . 750 parts In-Stock

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Corphita

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Advanced Electronics

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Overview

Enhance your electronic designs with the high-quality CD74AC541M96G4 bus driver & transceiver from Texas Instruments. This versatile component offers fast propagation delay, 3-state output characteristics, and a wide operating temperature range, making it ideal for various applications. With Texas Instruments' reputation for reliability and innovation, you can trust that this product will deliver exceptional performance and value. Upgrade your projects today with the CD74AC541M96G4 and experience the benefits of cutting-edge technology in a compact package.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10.9 ns

This low propagation delay ensures fast and efficient communication within the bus system.

Surface Mount: YES

The surface mount feature makes for easy installation and efficient use of PCB space.

No. of Bits: 8

With 8 bits, this bus driver & transceiver is capable of handling a wide range of data transmissions.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V supply voltage provides stable and reliable power to the device.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance helps in reducing signal distortion and improving signal quality.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the bus lines.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on PCBs.

Temperature Grade: MILITARY

This military-grade temperature range ensures reliability in extreme operating conditions.

Maximum Power Supply Current (ICC): 0.16 mA

The low power supply current makes this product energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers CD74AC541M96G4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

10.9 ns

Propagation Delay (tpd):

98 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CD74AC541M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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