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CD74AC238M96G4

Texas Instruments

CD74AC238M96G4 by Texas Instruments

CD74AC238M96G4 by Texas Instruments is an 8-bit decoder & driver with a propagation delay of 21 ns. It operates at a nominal voltage of 3.3V and has a max operating temperature of 125°C. This CMOS technology device is commonly used in military applications due to its small outline package and high reliability.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 4,281 parts In-Stock

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Digiode

USA . 1,852 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 264 parts In-Stock

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$6.589

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264

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Ampacity Inc.

Singapore . 468 parts In-Stock

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$23.000

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468

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Parana Technologies

USA . 1,400 parts In-Stock

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$29.255

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$57.331

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DigiPath Technology Company

USA . 1,560 parts In-Stock

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$32.214

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$29.636

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ChromeModa Solutions

Germany . 6,154 parts In-Stock

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$32.871

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$26.954

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IDEA Electronic Components Group

UK . 939 parts In-Stock

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$32.871

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$31.227

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$29.584

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939

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One Stop Electronics

USA . 442 parts In-Stock

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$47.000

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QUARKTWIN TECHNOLOGY LTD

USA . 25,505 parts In-Stock

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Microchip USA

USA . 4,763 parts In-Stock

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Corphita

USA . 4,283 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 650 parts In-Stock

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Overview

Discover the CD74AC238M96G4 by Texas Instruments, a high-quality decoder and driver that offers countless advantages. Manufactured by Texas Instruments, a renowned name in the industry, this product guarantees reliability and performance. With its versatile applications and compact design, it provides immense value to customers. Whether you're in need of efficient data decoding or driving multiple output devices, this product delivers exceptional results. Experience the benefits of fast propagation delay, standard input conditioning, and true output polarity. Trust Texas Instruments for all your decoding and driving needs!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product's use of a durable plastic/epoxy package body material ensures long-lasting performance and protection for the internal components.

Propagation Delay At Nominal Supply:

21 ns - With a low propagation delay, this decoder and driver can quickly and efficiently process signals, making it ideal for high-speed applications.

Surface Mount:

YES - Being surface mountable, this product offers ease of installation and integration into various electronic circuits and systems.

Input Conditioning:

STANDARD - The standard input conditioning capability of this product guarantees compatibility with a wide range of input signal types, providing versatility and flexibility in its application.

No. of Functions:

1 - This decoder and driver offers a single function, simplifying the design and reducing complexity for specific applications that require a specific functionality.

Package Shape:

RECTANGULAR - The rectangular package shape allows for easy mounting and efficient use of space in circuit board layouts, enhancing overall system compactness.

No. of Bits:

8 - With 8 bits, this decoder and driver can handle a wide range of binary inputs, making it suitable for various data processing and control applications.

Nominal Supply Voltage / Vsup (V):

3.3 - The 3.3V nominal supply voltage ensures compatibility with commonly used power supply systems, making it compatible with a wide range of applications.

Load Capacitance (CL):

50 pF - The load capacitance of 50 pF enables efficient and reliable signal transmission, ensuring accurate decoding and driving of connected devices.

Power Supplies (V):

3.3/5 - With support for both 3.3V and 5V power supplies, this product offers versatility and compatibility with different power systems, allowing for easy integration into various projects.

No. of Terminals:

16 - The 16 terminals provide ample connectivity options and ensure a secure and reliable connection, allowing for efficient signal transmission.

Package Style (Meter):

SMALL OUTLINE - The small outline package style enhances space efficiency and allows for seamless integration into compact electronic devices and systems.

Maximum I (ol):

24 Amp - With a maximum output current of 24 Amps, this decoder and driver can handle high-power applications, making it suitable for demanding tasks.

Propagation Delay (tpd):

187 ns - Although not the fastest, the propagation delay of 187 ns ensures reliable and accurate signal processing, making it suitable for most applications.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature of 125°C ensures robust performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature:

55 °C - With a low minimum operating temperature of -55°C, this decoder and driver can withstand extreme cold conditions, expanding its range of potential applications.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of nickel, palladium, and gold for terminal finishing enhances corrosion resistance and ensures reliable contacts, prolonging the product's lifespan.

Terminal Position:

DUAL - The dual terminal position provides flexibility in the layout and connection options, allowing for efficient integration into different circuit designs.

Maximum Seated Height:

1.75 mm - With a compact maximum seated height, this product can fit into space-constrained environments, making it suitable for small-scale applications.

Width:

3.9 mm - The narrow width enables efficient utilization of board space, allowing for compact and space-saving circuit designs.

Output Polarity:

TRUE - The true output polarity ensures compatibility and ease of integration with various devices and systems, enhancing the product's versatility.

Minimum Supply Voltage (Vsup):

1.5 V - The low minimum supply voltage requirement of 1.5V allows for flexibility in power supply options, making it compatible with a wide range of systems.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this product can withstand the soldering process without compromising its performance, ensuring reliability during manufacturing.

Length:

9.9 mm - The compact length facilitates easy integration into circuit board designs, allowing for space-efficient and streamlined installations.

Temperature Grade:

MILITARY - Designed to meet military-grade standards, this decoder and driver offers superior durability and reliability in harsh environments, making it suitable for rugged applications.

Technology:

CMOS - Utilizing CMOS technology, this product offers low power consumption and high noise immunity, resulting in improved overall performance and energy efficiency.

Terminal Form:

GULL WING - The gull-wing terminal form provides secure and reliable solder connections, ensuring stable operation in various conditions and facilitating easier automated assembly processes.

Packing Method:

TR - This product's tray packing method allows for convenient handling and protection during transportation, ensuring the product arrives in optimal condition.

Terminal Pitch:

1.27 mm - The terminal pitch of 1.27 mm enables easy alignment and soldering, simplifying the installation process and guaranteeing accurate connections.

Moisture Sensitivity Level (MSL):

1 - With an MSL level of 1, this product can withstand moisture exposure during storage and transportation, maintaining its reliability and performance.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and provides headroom for potential voltage fluctuations.

Maximum Power Supply Current (ICC):

0.16 mA - With a low maximum power supply current, this decoder and driver offers energy-efficient operation, minimizing power consumption and prolonging battery life.

Technical Specifications

Decoder & Drivers CD74AC238M96G4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

187 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74AC238M96G4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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