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CD4555BPWRG4

Texas Instruments

CD4555BPWRG4 by Texas Instruments

CD4555BPWRG4 by Texas Instruments is a 16-terminal decoder with 190ns propagation delay, suitable for military applications. It operates at a supply voltage range of 3-18V and features a max power supply current of 3mA. The package style is small outline, thin profile, shrink pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,138 parts In-Stock

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Digiode

USA . 1,721 parts In-Stock

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One Stop Electronics

USA . 1,149 parts In-Stock

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$6.000

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Native Components

USA . 884 parts In-Stock

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$7.685

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$7.685

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AZTECH Wire

Italy . 361 parts In-Stock

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$13.837

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$13.837

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Parana Technologies

USA . 1,377 parts In-Stock

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$26.862

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$29.410

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ChromeModa Solutions

Germany . 2,807 parts In-Stock

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$30.182

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$24.749

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$24.749

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IDEA Electronic Components Group

UK . 1,033 parts In-Stock

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$30.182

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$28.673

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$27.164

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Microchip USA

USA . 2,180 parts In-Stock

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Northwest PG Solutions

USA . 855 parts In-Stock

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855

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DigiPath Technology Company

USA . 623 parts In-Stock

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$27.212

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Corphita

USA . 96 parts In-Stock

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Overview

Unlock the power of innovation with the CD4555BPWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that set the standard for excellence. This decoder & driver offers unmatched precision and reliability, making it ideal for a wide range of applications. Experience seamless performance and exceptional value with the CD4555BPWRG4, providing you with the edge you need to succeed in today's competitive market. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 190 ns

Low propagation delay ensures quick response time, making the product efficient for decoding and driving purposes.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards.

No. of Functions: 2

Having multiple functions in one device saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many electronic systems.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for industrial and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Decoder & Drivers CD4555BPWRG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

3 mA

Propagation Delay At Nominal Supply:

190 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD4555BPWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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