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CD4511BCN/A+

Texas Instruments

CD4511BCN/A+ by Texas Instruments

CD4511BCN/A+ by Texas Instruments is a CMOS graphics display driver with 7 segments. It operates at temperatures from -40 to 85°C, powered by 5/15V supplies. Ideal for industrial applications requiring segment display mode in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,357 parts In-Stock

1+ parts

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3,357

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Digiode

USA . 1,886 parts In-Stock

1+ parts

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1,886

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Anansix

USA . 1,215 parts In-Stock

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1,215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 4 parts In-Stock

1+ parts

$6.030

100+ parts

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4

$6.030

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Parana Technologies

USA . 565 parts In-Stock

1+ parts

$7.156

100+ parts

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$7.666

10k+ parts

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565

$7.156

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$7.666

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DigiPath Technology Company

USA . 387 parts In-Stock

1+ parts

$7.880

100+ parts

$7.250

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387

$7.880

$7.250

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$8.041

100+ parts

-

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$7.237

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2,033

$8.041

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$7.237

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ChromeModa Solutions

Germany . 1,857 parts In-Stock

1+ parts

$8.041

100+ parts

$6.594

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-

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1,857

$8.041

$6.594

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AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$18.044

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785

$18.044

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One Stop Electronics

USA . 681 parts In-Stock

1+ parts

$39.500

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681

$39.500

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Corphita

USA . 5,231 parts In-Stock

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5,231

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Northwest PG Solutions

USA . 949 parts In-Stock

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$5.909

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949

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$5.909

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Overview

Enhance your graphic display projects with the CD4511BCN/A+ by Texas Instruments. Known for their top-notch quality and reliable performance, Texas Instruments delivers yet another exceptional product in the category of Graphics Display Drivers. This versatile component offers seamless integration, precise control, and unparalleled efficiency, making it the ideal choice for a wide range of applications. Elevate your designs and achieve superior results with the CD4511BCN/A+ from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the graphics display driver, ensuring a longer lifespan.

Display Mode: SEGMENT

Segment display allows for clear and easy-to-read information on the screen, making it user-friendly.

Power Supplies (V): 5/15

The availability of multiple power supply options allows for flexibility in different applications and environments.

No. of Terminals: 16

Having a sufficient number of terminals enables easy connectivity and integration with other components of the system.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and space-saving design, making it suitable for applications where size is a consideration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in a wide range of environments, including extremely cold conditions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the graphics display driver can withstand harsh conditions and operate reliably in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the graphics display driver energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are easy to solder, ensuring stable and reliable performance of the graphics display driver.

Technical Specifications

Graphics Display Drivers CD4511BCN/A+ attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Additional Features:

COMMON-CATHODE

Display Mode:

SEGMENT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Sub-Category:

Display Drivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CD4511BCN/A+ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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