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CD4099BPWG4

Texas Instruments

CD4099BPWG4 by Texas Instruments

CD4099BPWG4 by Texas Instruments is a CMOS latch with 400 ns propagation delay at 5V, suitable for military applications. It has a small outline package with 16 terminals and operates b/w -55 to 125 °C. The device features low-level trigger type and true output polarity, making it ideal for high-reliability systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,388 parts In-Stock

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Digiode

USA . 3,048 parts In-Stock

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3,048

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Distributors (Availability)

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Parana Technologies

USA . 1,435 parts In-Stock

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$9.381

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$10.000

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1,435

$9.381

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$10.000

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DigiPath Technology Company

USA . 1,503 parts In-Stock

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$10.329

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$10.329

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ChromeModa Solutions

Germany . 2,380 parts In-Stock

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$10.540

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$8.643

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$10.540

$8.643

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IDEA Electronic Components Group

UK . 212 parts In-Stock

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$10.540

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$10.013

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$9.486

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212

$10.540

$10.013

$9.486

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One Stop Electronics

USA . 1,405 parts In-Stock

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$12.000

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1,405

$12.000

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AZTECH Wire

Italy . 530 parts In-Stock

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$18.432

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530

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Corphita

USA . 3,676 parts In-Stock

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Microchip USA

USA . 3,601 parts In-Stock

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Northwest PG Solutions

USA . 2,159 parts In-Stock

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Native Components

USA . 716 parts In-Stock

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Overview

Experience superior performance and reliability with the CD4099BPWG4 by Texas Instruments, a leading manufacturer in the industry. This versatile latch and flip-flop device is ideal for a wide range of applications, providing seamless operation with a nominal supply voltage of 5V. Enjoy the benefits of its fast propagation delay, compact package shape, and high-quality plastic/epoxy material. Enhance your projects with the exceptional value and efficiency that this product offers, making it the perfect choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protects the internal components of the latch or flip-flop, making it suitable for various applications and environments.

Propagation Delay: 400 ns

With a low propagation delay of 400 ns, this latch or flip-flop allows for fast signal processing and reliable operation in time-sensitive applications.

Surface Mount: YES

Being surface mountable, this product offers easy installation on printed circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V supply voltage, this latch or flip-flop can be easily integrated into existing electronic systems without the need for additional power conversion.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile package design with shrink pitch saves space on the PCB, making it ideal for applications where board real estate is limited.

Trigger Type: LOW LEVEL

With a low-level trigger type, this latch or flip-flop responds to a specific voltage level, ensuring reliable and precise signal control in digital systems.

Temperature Grade: MILITARY

Designed to operate in extreme temperature ranges, this latch or flip-flop is suitable for military and rugged industrial applications where reliability under harsh conditions is crucial.

Technology: CMOS

Utilizing CMOS technology, this latch or flip-flop offers low power consumption and high noise immunity, making it energy-efficient and reliable in noise-prone environments.

Technical Specifications

Latches & Flip-Flops CD4099BPWG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

CD4099BPWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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