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CD4099BMG4

Texas Instruments

CD4099BMG4 by Texas Instruments

CD4099BMG4 by Texas Instruments is a CMOS latch with 150ns propagation delay, 5V nominal voltage, and 50pF load capacitance. Ideal for military applications due to its low trigger level and wide operating temperature range from -55°C to 125°C. This small outline package features surface mount capability and dual terminal position for versatile integration.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,018 parts In-Stock

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Digiode

USA . 2,328 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 244 parts In-Stock

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$6.867

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244

$6.867

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Parana Technologies

USA . 370 parts In-Stock

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$15.118

100+ parts

$1,403.893

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$13.606

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370

$15.118

$1,403.893

$13.606

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DigiPath Technology Company

USA . 543 parts In-Stock

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$16.646

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$15.315

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543

$16.646

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ChromeModa Solutions

Germany . 6,543 parts In-Stock

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$16.986

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$13.929

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6,543

$16.986

$13.929

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IDEA Electronic Components Group

UK . 1,382 parts In-Stock

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$16.986

100+ parts

$16.137

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$15.287

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$16.986

$16.137

$15.287

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One Stop Electronics

USA . 1,546 parts In-Stock

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$54.000

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Component Stockers USA

USA . 681 parts In-Stock

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$99.990

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Microchip USA

USA . 4,695 parts In-Stock

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Corphita

USA . 2,407 parts In-Stock

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Northwest PG Solutions

USA . 1,380 parts In-Stock

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$4.274

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Native Components

USA . 284 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled precision and reliability with the CD4099BMG4 by Texas Instruments. Crafted with cutting-edge technology and superior quality materials, this latches & flip-flops device guarantees seamless performance in a variety of applications. Experience lightning-fast response times and effortless integration with its unmatched propagation delay and nominal supply voltage. Elevate your projects to new heights with the unbeatable value and benefits that only Texas Instruments can deliver. Make the smart choice for your next project and choose the CD4099BMG4 for unrivaled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and provides good protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 150 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common in many electronic systems, making this latch or flip-flop compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance helps reduce the power consumption and improve the overall performance of the latch or flip-flop.

Technical Specifications

Latches & Flip-Flops CD4099BMG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.3 mA

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

CD4099BMG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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