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CD4067BM96E4

Texas Instruments

CD4067BM96E4 by Texas Instruments

CD4067BM96E4 by Texas Instruments is a CMOS multiplexer with 16 channels, operating at a nominal voltage of 5V. It features a max on-state resistance of 1050 ohm and offers separate outputs. This small outline package is ideal for military-grade applications requiring high-speed switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,210 parts In-Stock

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Digiode

USA . 1,369 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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One Stop Electronics

USA . 1,213 parts In-Stock

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$1.500

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Ampacity Inc.

Singapore . 611 parts In-Stock

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$5.500

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Parana Technologies

USA . 150 parts In-Stock

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$7.583

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$8.094

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DigiPath Technology Company

USA . 561 parts In-Stock

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$8.350

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$7.682

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ChromeModa Solutions

Germany . 4,708 parts In-Stock

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$8.520

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$6.986

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IDEA Electronic Components Group

UK . 1,641 parts In-Stock

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$8.520

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$7.668

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AZTECH Wire

Italy . 889 parts In-Stock

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Corohmni

South Africa . 866 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,154 parts In-Stock

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Microchip USA

USA . 10,702 parts In-Stock

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Corphita

USA . 4,423 parts In-Stock

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Argo Parts USA

USA . 2,779 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 38 parts In-Stock

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Overview

Discover the Texas Instruments CD4067BM96E4, a top-quality multiplexer and switch designed to meet your application needs with precision and reliability. With Texas Instruments' renowned expertise in semiconductor manufacturing, you can trust in the superior performance and durability of this product. Perfect for a wide range of applications, this device offers seamless switching capabilities and efficient signal routing, ensuring optimal functionality in your projects. Upgrade your systems today with the value and benefits that the CD4067BM96E4 brings to the table, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage for compatibility with common power sources.

No. of Terminals: 24

Offers a sufficient number of terminals for connecting multiple input and output devices.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Channels: 16

Provides a high number of channels for versatile signal routing and switching capabilities.

Technical Specifications

Multiplexers & Switches CD4067BM96E4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

14 kHz

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

24

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

440 ns

Maximum Switch-on Time:

650 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

CD4067BM96E4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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